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Microchip’s Low-Power Radiation-Tolerant (RT) PolarFire FPGA is Available in Engineering Silicon and On a Path to Full QML Class V Spaceflight Qualification
Customers can prototype with the same FPGA silicon and package that is now headed for space qualification

Microchip Technology announced it is shipping engineering silicon for its RT PolarFire® Field Programmable Gate Array (FPGA) while the device is being qualified to spaceflight component reliability standards. Designers can now create hardware prototypes with all the same electrical and mechanical performance that the space-qualified RT PolarFire FPGAs will provide for high-bandwidth on-orbit processing systems with industry-low power consumption and the ability to withstand radiation effects in space.

“This is a major milestone as we release RT PolarFire FPGA engineering silicon to our customers and begin the spaceflight qualification process through full QML Class V standards,” said Bruce Weyer, vice president of Microchip’s FPGA business unit. “Many of our customers have already jump-started satellite system payload development using our commercial PolarFire MPF500T FPGAs and now all prototyping can be done with silicon that will be identical in form, fit and function to our eventual flight-qualified RT PolarFire FPGAs.”

Microchip is qualifying its RT PolarFire RTPF500T FPGAs to Mil Std 883 Class B, QML Class Q and QML Class V -- the highest qualification and screening standard for monolithic integrated circuits in space. Designed to survive a rocket launch and meet demanding performance needs in space, RT PolarFire FPGAs are ideal for applications including high-resolution passive and active imaging, precision remote scientific measurement, multi-spectral and hyper-spectral imaging, and object detection and recognition using neural networks. These applications require high levels of operating performance and density, low heat dissipation, low power consumption and low system-level costs.

About the RT PolarFire FPGA

Microchip’s RT PolarFire FPGAs increase computational performance so satellite payloads can transmit processed information rather than raw data and make optimal use of limited downlink bandwidth. The devices exceed the performance, logic density and serializer-deserializer (SERDES) bandwidth of any other currently available space-qualified FPGA. They also enable more system complexity than previous FPGAs and withstand Total Ionizing Dose (TID) exposure beyond the 100 kilorads (kRads) typical of most earth-orbiting satellites and many deep-space missions. Their power-efficient architecture reduces power consumption up to 50 percent compared to SRAM FPGAs, leveraging SONOS configuration switches that also eliminate the problem of configuration upsets due to radiation in space.

Availability

The RT PolarFire RTPF500T FPGA engineering models are available in a hermetically sealed ceramic package with land grid, solder ball and solder column termination options. They are supported by development boards, Microchip’s Libero® software tool suite and radiation data. Additional information is available here.

Please let us know if you would like to speak to a subject matter expert on Microchip’s RT PolarFire FPGAs and the challenges of high-performance computing in space.

2020121601 / 16.12.2020 / Electronic-components / Microchip Technology Inc. /

Microchip Launches New dsPIC® DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device
A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market

Microchip Expands its mSiC™ Solutions with the 3.3 kV XIFM Plug-and-Play mSiC Gate Driver to Accelerate the Adoption of High-Voltage SiC Power Modules
The highly integrated 3.3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration

Microchip’s Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
Cost-sensitive development platform helps student, beginner and seasoned designers work with emerging technologies

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Microchip Earns Certification in ISO/SAE 21434 Road Vehicle—Cybersecurity Engineering Standard from UL Solutions
Designing with certified security products can help Tier 1s and OEMs prove cybersecurity risk management compliance

The Next Evolutionary Step in Customizable Logic, Microchip Releases PIC16F13145 Family of MCUs
New Configurable Logic Block (CLB) module offers tailored hardware solutions and helps eliminate the need for external logic components

Microchip Launches 10 Multi-Channel Remote Temperature Sensors
MCP998x family represents one of the largest automotive-grade remote temperature sensor portfolios available from a single vendor

Next-Generation Family of Ethernet Switches Features Time Sensitive Networking and Scalable Port Bandwidths from 46 Gbps to 102 Gbps
Microchip’s LAN9694, LAN9696 and LAN9698 devices are integrated with High-availability Seamless Redundancy (HSR) and Parallel Redundancy Protocol (PRP) for ease of design

Microchip Launches AVR® EB Family of Microcontrollers to Reduce Noise, Vibration and System Harshness in BLDC Applications
Offers a smaller, more cost-effective solution for sophisticated waveform control with increased efficiency

Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing
Microchip’s SP1F and SP3F power modules are highly configurable in Silicon Carbide (SiC) or Silicon (Si) technology and now available with Press-Fit terminals

Microchip Unveils New Standard of Enhanced Code Security With the PIC18-Q24 Family of MCUs
Added voltage level shifting capabilities help increase flexibility and reduce system costs

To Meet And Exceed Heightened Automotive Secure Authentication Requirements, Microchip Releases Its Latest TrustAnchor Security IC
Available as a CryptoAuthentication™ or CryptoAutomotive™ Secure IC, the new TA101 device focuses on larger key sizes and enhanced cybersecurity requirements

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