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3D image sensor: Infineon enables easy smartphone unlock by face recognition
One megatrend feature in mobile communications is to unlock smartphones by 3D face recognition instead of fingerprint or PIN. Making authentication more convenient and more secure, it may soon become indispensable for mobile payment applications and mobile ID. With the 3D image sensor chip from Infineon Technologies AG the unlock-with-your-face feature becomes smarter, faster and more reliable.

Together with its innovation partner pmdtechnologies AG, Infineon has developed a new 3D image sensor in its REAL3™ chip family, based on Time-of-flight (ToF) technology. It enables the world’s smallest camera module for integration in smartphones with a footprint of less than 12 mm x 8 mm, including the receiving optics and VCSEL (Vertical-Cavity Surface-Emitting Laser) illumination. Infineon and pmdtechnologies will present their product innovation at CES ® 2018 (Consumer Electronics Show, 9-12 January 2018, Las Vegas, booth MP26065 in South Hall 2 of the Las Vegas Convention Center). Produced in Dresden and developed in Munich and Graz, the chip comes with expertise from Germany and Austria.

Advantages of Time-of-flight support rapid market growth

Market forecasts expect smartphones with 3D sensing functionality to increase from about 50 million units in the year 2017 to roughly 290 million units in 2019. Compared to other 3D sensor principles, such as stereoscopic light or structured light approaches, Time-of-flight offers advantages in performance, size and power consumption of battery-operated mobile devices.

Two factors provide the camera’s range and measurement accuracy: the intensity of the emitted and reflected infrared light, and the pixel sensitivity of the 3D image sensor chip. The REAL3 chip has 38,000 pixels with each pixel featuring the unique Suppression of Background Illumination (SBI) circuitry. It is tuned to work at 940 nm infrared light sources making the projected light invisible and improving the outdoor performance even further. Furthermore, the IRS238xC integrates a dedicated function to support Laser-Class-1 safety level of the complete solution.

ToF camera module is ready for mass production

Cameras of Infineon and pmdtechnologies are the only ToF-based depth cameras integrated in commercially available smartphones. They have convinced leading camera module makers for mobile phones and are proven for efficient volume production with high yield. In addition, they do not have to be re-calibrated during use.

Availability

Samples of the new Infineon 3D image sensor chip are already available. Volume production is scheduled to start in Q4 2018. Software partners like Sensible Vision Inc. and IDEMIA offer application software for user face detection and authentication. Demos with REAL3 3D image sensor chip are available.

Technical information about the 3D image sensor chips REAL3 is available at www.infineon.com/real3 and at www.infineon.com/3d-imaging. Information about pmdtechnologies is available at www.pmdtec.com. The Infineon CES highlights are available at www.infineon.com/CES.

2018010711 / 07.01.2018 / Electronic-components / Infineon Technologies AG /

Infineon launches next-generation ZVS flyback converter chipset for advanced USB-C PD adapters and chargers
The growing popularity of USB-C power delivery (PD) charging increases the demand for compatible chargers. Users now seek powerful yet compact adapters.

Infineon Lighting Shoe: Infineon develops worldwide unique shoe prototype with adidas that listens to music and reacts to it with lighting effects

Infineon’s single-chip solution for NFC lock applications enables KISS to take self-storage to the next level with new smart lock solution

Infineon introduces new automotive 60 V and 120 V OptiMOS™ 5 in TOLx packages for 24 V-72 V supplied high power ECUs
The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified. Therefore, the automotive market for Electronic Control Units (ECUs) powered by 24 V-72 V is expected to keep growing in the coming years.

Infineon presents highly integrated XENSIV™ 60 GHz radar sensor for consumer electronics, IoT applications, and healthcare devices

Engine management and pneumatic seat systems: Infineon launches two XENSIV™ barometric air pressure sensors

Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions

Infineon introduces a new single-stage flyback controller for battery charging applications, enabling hassle-free and scalable designs
Battery-powered appliances, one of the industry’s fastest-growing segments, require energy-efficient, robust, and cost-effective battery charging. For this reason Infineon Technologies AG extends its offering of AC-DC controller ICs by introducing the ICC80QSG single-stage PWM controller for flyback topologies.

Infineon’s CoolSiC™ devices support bi-directional inverter from Delta to let electric vehicles become emergency backup power

Infineon and Oxford Ionics join forces to develop leading Trapped Ion Quantum Processors
Infineon Technologies AG and Oxford Ionics announce a collaboration to build high-performance and fully integrated quantum processing units (QPUs).

Optimized CoolSiC™ MOSFETs 650 V in D²PAK for lowest losses in the application and highest reliability in operation

World’s first TPM 2.0 with open-source software stack cuts down security integration efforts in industrial, automotive and IoT applications
Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption and user authentication. Hence, they are crucial for connected industrial, automotive and other embedded devices.

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