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Reduce Driver Distraction with Automotive-Qualified 3D Gesture Recognition Controller
Decrease automotive 3D HMI design costs with Microchip’s new gesture controller

Car manufacturers are increasingly seeking ways to reduce driver distraction through implementing functional safety technology in vehicles. Many Human Machine Interface (HMI) designers are turning to gesture recognition as a solution to improve driver and vehicle safety without sacrificing interior design, adding features that allow drivers to easily control everything from switching on lights to answering phone calls while focusing on the road. Microchip Technology Inc. (NASDAQ: MCHP) today announced a new three-dimensional (3D) gesture recognition controller that offers the lowest system cost in the automotive industry, providing a durable single-chip solution for advanced automotive HMI designs. The MGC3140 joins Microchip’s family of easy-to-use 3D gesture controllers as the first qualified for automotive use.

Suited for a range for applications that limit driver distraction and add convenience to vehicles, Microchip’s new capacitive technology-based air gesture controller is ideal for navigating infotainment systems, sun shade operation, interior lighting and other applications. The technology also supports the opening of foot-activated rear liftgates and any other features a manufacturer wishes to incorporate with a simple gesture action. The MGC3140 is Automotive Electronics Council AEC-Q100 qualified with an operating temperature range of -40 to +125 degrees Celsius, and it meets the strict electromagnetic interference (EMI) and electromagnetic compatibility (EMC) requirements of automotive system designs. Each 3D gesture system consists of a sensor that can be constructed from any conductive material, as well as the Microchip gesture controller tuned for each individual application.

 “With the MGC3140, we’re bringing a proven gesture technology that provides an intuitive human interface to reduce driver distraction in vehicles,” said Fanie Duvenhage, vice president of Microchip’s Human Machine Interface business unit. “Microchip is committed to supporting the automotive market with a growing portfolio of touch and gesture controllers alongside leading technical support. This device gives customers a cost-effective gesture solution without compromising on the interior design of a vehicle.”

While existing solutions such as infrared and time-of-flight technologies can be costly and operate poorly in bright or direct sunlight, the MGC3140 offers reliable sensing in full sunlight and harsh environments. Other solutions on the market also come with physical constraints and require significant infrastructure and space to be integrated in a vehicle. The MGC3140 is compatible with ergonomic interior designs and enables HMI designers to innovate with fewer physical constraints, as the sensor can be any conductive material and hidden from view.

Development Tools

The Emerald evaluation kit provides a convenient evaluation platform for the 3D gesture recognition controller. The kit includes a reference Printed Circuit Board (PCB) with the MGC3140 controller, a PCB-based sensor to recognize gestures, as well as all needed cables, software and documentation to support an easy-to-use user experience. All parts are compatible with Microchip’s Aurea software development environment which supports all Microchip 3D gesture controllers.

Pricing and Availability

The MGC3140 is available now in sampling and volume production quantities. Pricing is available upon request. For additional information, contact any Microchip sales representative or authorized worldwide distributor, or visit Microchip’s website.

2018071402 / 12.07.2018 / Electronic-components / Microchip Technology Inc. /

Microchip and Marelli Pioneer Open-Standard Display Connectivity Solution for Software-Defined Vehicles
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Plug-and-Play 90W PoE Solution Streamlines Industrial IoT Deployments
Microchip’s industrial-grade Power over Ethernet (PoE) midspans enable device deployment wherever needed, without any switch replacements or upgrades

Microchip Technology, in Collaboration With Micron Technology, Demonstrates High-Performance PCIe® Gen 6 Storage Architecture for AI and Data Center Infrastructure
Switchtec™ PCIe Switches and Micron® 9650 NVMe® solid state drives (SSDs) leverage next generation interface technology to deliver increased bandwidth, low latency, and scalable storage connectivity

Microchip Advances Neural Network Implementation with VectorBlox™ 3.0 Accelerator Software Development Kit
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XpressConnect™ PCIe® 6.0 and CXL 3.1 Retimers Address Latency and Signal‑Integrity Challenges in AI Data Centers
Strengthening Microchip Technology’s data center solutions portfolio, the retimers support high‑bandwidth architectures while helping reduce integration complexity

Essential Performance and Real-time Control Without the Baggage
Microchip’s dsPIC33CK Value Line DSCs offer streamlined design for cost-sensitive applications and consistent pricing regardless of order size

Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers
New silicon carbide modules deliver the required thermal performance and efficiency for SSTs to increase power available for token generation

New EX‑423 Evacuated Miniature Crystal Oscillator for Critical Timing in Low- and Battery-Powered Applications
Ruggedized in an ultra-high vacuum for enhanced thermal insulation, the EX-423 delivers stability and RF performance

Next‑Generation 100/1000BASE‑T1 Single Pair Ethernet PHYs Integrate MACsec Security, Time Sensitive Networking and Functional Safety
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New BZPACK mSiC® Power Modules Are Designed for Demanding Applications in Harsh Environments
The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC MOSFET families

Mythic® Selects memBrain™ Technology from Silicon Storage Technology® for its Next Generation of Ultra-Low-Power Analog Processing Units
With SuperFlash® memory, Mythic’s APU achieves 120 TOPs/watt performance for low-power AI inferencing

New Power Module Enhances AI Data Center Power Density and Efficiency
Microchip’s MCPF1525 power module with PMBus™ delivers 25A DC-DC power, stackable up to 200A


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