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Create High-Resolution Audio Devices Using Microchip’s New Bluetooth® Audio SoC with Sony’s LDAC™ Technology
Bluetooth 5-compliant SoC enables immersive audio sound in Audeze’s award-winning, high-end Mobius gaming headphones

With mainstream consumer demand for high-quality audio experiences growing, consumers expect Bluetooth audio devices to create an immersive and uninterrupted listening experience. However, Bluetooth audio designs are often limited by the bit depth and frequency rate of existing codecs, which are the communication and compression technology used to send audio over the air. Now designers of audio systems have a fully-certified, Bluetooth 5-compliant System-on-Chip (SoC) with Sony’s LDAC audio codec technology* in the IS2064GM-0L3 from Microchip Technology Inc. (NASDAQ: MCHP). The SoC allows manufacturers to develop a new generation of audio devices with an advanced codec, extending high-resolution audio beyond audiophiles and into mass market Bluetooth wireless products. Upscale headphone manufacturer, Audeze, has implemented the SoC into their high-end Mobius gaming headphone. For more information on the SoC visit: http://www.microchip.com/IS2064.

The Audeze Mobius headphone utilizes Microchip’s IS2064GM-0L3 SoC for the Bluetooth wireless connection supporting LDAC and other audio codec interfaces. Sony's LDAC is considered the highest-quality audio codec available. It transmits up to 990 kbps data throughput, which is three times higher than the standard Bluetooth Sub-band Codec (SBC), and maintains frequency and bit depth of up to 96 kHz/24-bit. The high compression and reproduction efficiency enables high-resolution audio listening experiences for Bluetooth audio devices.

“Our new Mobius headphone features many groundbreaking technologies. To ensure high-quality Bluetooth audio we implemented Microchip’s IS2064GM-0L3 SoC in our headphones,” said Sankar Thiagasamudram, CEO of Audeze. “Thanks to the outstanding support from Microchip, we were able to incorporate the LDAC codec quickly and easily into our products.”

The IS2064GM-0L3 SoC not only makes the LDAC codec available to the broader market of audio product vendors, it also allows customers to utilize Microchip’s outstanding global technical support and comprehensive development environment to assist customers with implementation and getting to market faster. The LDAC codec is also integrated into the Android 8.0 Oreo™ operating system Bluetooth stack, making the LDAC technology more widely available on the transmit side.

“Microchip enables OEMs to address consumers’ increasing demand for high-quality audio with the convenience and ubiquity of Bluetooth wireless,” said Steve Caldwell, vice president of Microchip’s wireless solutions group. “OEMs can focus on their audio product and sound quality and know that, because of Microchip, the Bluetooth wireless integration will be seamless.”

Development Tools

The IS2064GM-0L3 is available to customers upon request after approval. Development boards are also available.

Pricing and Availability

The IS2064GM-0L3 comes in an 8 x 8 mm LGA package and is available for volume production starting at $4.90 each in 10,000-unit quantities. Please contact Sony for additional licensing requirements when using LDAC technology: www.sony.net/Products/LDAC/index.html.

For additional information, contact any Microchip sales representative, visit Microchip’s website or send an email to BTAudio@microchip.com. To learn more about Microchip’s complete line of Bluetooth audio products, visit Microchip’s Bluetooth Audio Design Center.

2018080502 / 05.08.2018 / Electronic-components / Microchip Technology Inc. /

PIC32CM PL10 MCUs Expand Microchip’s Arm® Cortex®-M0+ Portfolio
Low-power, 5V‑capable devices deliver high performance while preserving low system complexity and costs

Microchip Expands maXTouch® M1 Touchscreen Controller Series for Broader Display Size Coverage
New Touch controllers bring reliable touch sensing to both very small and very large display formats in modern automotive applications

Microchip Launches Military-Qualified Plastic Transient Voltage Suppressors for Aerospace and Defense Applications
The JANPTX devices meet the MIL-PRF-19500 qualification and offer a high peak pulse power rating of 1.5 kW

Microchip Releases Custom Firmware For NVIDIA DGX Spark For Its MEC1723 Embedded Controllers
Solution delivers secure boot, power management and system control for complex computing

Microchip Halves the Power Required to Measure How Much Power Portable Devices Consume
Power- and battery-conscious designs can operate longer under typical conditions through more accurate and energy-efficient power monitoring

Four-Channel Thermocouple Measurement with Integrated Conditioning Now Possible with ±1.5°C System Accuracy
Microchip’s MCP9604 thermocouple conditioning IC reduces the cost and complexity of in-line production applications that operate in high and low temperature extremes

Microchip Introduces Flexible New Family of Gigabit Ethernet Switches with TSN/AVB and Redundancy For Industrial Applications
Microchip’s next generation LAN9645xF and LAN9645xS GbE switches are highly configurable with multiple ports and advanced features

New DualPack 3 IGBT7 Modules Deliver High Power Density and Simplify System Integration
Microchip launches six variants targeting high-growth motor drive, data center and sustainability applications

Deca and Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
The collaboration provides customers with a modular, memory-centric foundation for advanced multi-die architectures

Easily Integrate Position, Navigation and Timing Technology With Microchip’s Portfolio of GNSS Disciplined Oscillator Modules
These high-performance, small-form-factor timing systems are designed for defense applications in GNSS-denied environments

Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions for the Future of Power Management
This agreement leverages Microchip’s mSiC™ technology and Delta’s smart energy-saving solutions to accelerate the development of sustainable applications

Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
Latest achievements highlight over 60 years of space heritage and commitment to high-reliability, radiation-tolerant technology for next-generation satellite and avionics systems.


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electronica 2024, 12.11.-15.11.2024, Munich, DE

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electronica 2026, München, DE, 10.-13.11.2026

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