Address Book
 

Mitutoyo
 

Vox Power
 

Texas Instruments
 

STMicroelectronics
 

Future Electronics
 

TELEDYNE Vision Solution
 

Vexlum
 

Mitsubishi Electric
 

Parker Hannifin
 

QUECTEL
 

Infineon Technologies AG
 

Seica
 

NeoCortec
 

PULSIV
 

MikroElektronika d.o.o.

18.10.2026 1:41:36
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

EVPBB5AHE00
 
Panasonic Industry launches tiny tactile
EMB-LR1121
 
Wireless module maker Embit signs NeoMes
Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY

Connect PIC® MCU Applications to Google Cloud in Minutes with Microchip’s New Development Board for Cloud IoT Core
Solution enables large ecosystem of PIC MCU applications to easily add secure cloud connectivity to next-generation designs

From coffee makers to thermostats to irrigation systems, PIC microcontrollers (MCU) are at the heart of millions of embedded applications. As developers migrate next-generation PIC MCU-based applications to the cloud, they currently must overcome complexities associated with communications protocols, security and hardware compatibility. To accelerate the development of these applications, Microchip Technology Inc. (Nasdaq: MCHP) today announced a new Internet of Things (IoT) rapid development board for Google Cloud IoT Core that combines a low-power PIC® microcontroller (MCU), CryptoAuthentication™ secure element IC and fully certified Wi-Fi® network controller. The solution provides a simple way to connect and secure PIC MCU-based applications, removing the added time, cost and security vulnerabilities that come with large software frameworks and Real Time Operating Systems (RTOS). Once connected, Google Cloud IoT Core provides powerful data and analytics to help designers make better, smarter products.  

As part of Microchip’s extended partnership with Google Cloud, the PIC-IoT WG Development Board enables PIC MCU designers to easily add cloud connectivity to next-generation products using a free online portal at www.PIC-IoT.com. Once connected, developers can use Microchip’s MPLAB® Code Configurator (MCC) rapid development tool to develop, debug and customize their application. The board combines smart, connected and secure devices to enable designers to create connected applications in minutes, including:

  • eXtreme Low-Power (XLP) PICMCU with integrated Core Independent Peripherals: Ideal for battery-operated, real-time sensing and control applications, the PIC24FJ128GA705 MCU provides the simplicity of the PIC architecture with added memory and advanced analog integration. With the latest Core Independent Peripherals (CIPs) designed to handle complex applications with less code and decreased power consumption, the device provides the ideal combination of performance with extremely low power consumption.
  • Secure element to protect the root of trust in hardware: The ATECC608A CryptoAuthentication device provides a trusted and protected identity for each device that can be securely authenticated. ATECC608A devices come pre-registered on Google Cloud IoT Core and are ready for use with zero-touch provisioning.
  • Wi-Fi connectivity to Google Cloud: The ATWINC1510 is an industrial-grade, fully certified IEEE 802.11 b/g/n IoT network controller that provides an easy connection to an MCU of choice via a flexible SPI interface. The module relieves designers from needing expertise in networking protocols.

“Microchip continues to introduce new rapid development tools that enable PIC MCU designers to meet changing application requirements and create differentiated products,” said Steve Drehobl, vice president of Microchip’s 8- and 16-bit MCU business units. “As designers add cloud connectivity and migrate their applications to the Internet of Things (IoT), our PIC-IoT WG development board provides a simplified development process to bring designs to market quickly.”

Google Cloud IoT Core provides a fully managed service that enables designers to easily and securely connect, manage and ingest data from devices at a global scale. The platform collects, processes and analyzes data in real time to enable designers to improve operational efficiency in embedded designs.

“The PIC-IoT WG development board provides Google Cloud IoT customers another option to accelerate the development of cloud-connected applications, without compromising on security,” said Antony Passemard, Head of Product Management for Google Cloud IoT. “Combined with Google Cloud Platform’s network infrastructure and Google’s IoT services, the simplicity of the board makes powerful analytics tools and unique machine learning capabilities accessible to anyone.”

The PIC-IoT WG development board joins the recently announced AVR-IoT WG development board, giving designers the flexibility to easily create cloud-connected applications with their preferred MCU architecture.  

2019022401 / 01.03.2019 / Test & measurement / Microchip Technology Inc. /

AnalogAI Selects memBrain™ SAGE Intellectual Property from Silicon Storage Technology® for its First Real-world Edge AI Processors
Proprietary on-device training built to dynamically adapt to real-world environments

Microchip and Marelli Pioneer Open-Standard Display Connectivity Solution for Software-Defined Vehicles
Solution streams graphics and videos from centralized compute systems to automotive displays using standards-based ASA Motion Link connectivity

Plug-and-Play 90W PoE Solution Streamlines Industrial IoT Deployments
Microchip’s industrial-grade Power over Ethernet (PoE) midspans enable device deployment wherever needed, without any switch replacements or upgrades

Microchip Technology, in Collaboration With Micron Technology, Demonstrates High-Performance PCIe® Gen 6 Storage Architecture for AI and Data Center Infrastructure
Switchtec™ PCIe Switches and Micron® 9650 NVMe® solid state drives (SSDs) leverage next generation interface technology to deliver increased bandwidth, low latency, and scalable storage connectivity

Microchip Advances Neural Network Implementation with VectorBlox™ 3.0 Accelerator Software Development Kit
Latest release leverages sparse neural networks to improve performance and enable more efficient edge AI on PolarFire® FPGAs and SoCs

XpressConnect™ PCIe® 6.0 and CXL 3.1 Retimers Address Latency and Signal‑Integrity Challenges in AI Data Centers
Strengthening Microchip Technology’s data center solutions portfolio, the retimers support high‑bandwidth architectures while helping reduce integration complexity

Essential Performance and Real-time Control Without the Baggage
Microchip’s dsPIC33CK Value Line DSCs offer streamlined design for cost-sensitive applications and consistent pricing regardless of order size

Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers
New silicon carbide modules deliver the required thermal performance and efficiency for SSTs to increase power available for token generation

New EX‑423 Evacuated Miniature Crystal Oscillator for Critical Timing in Low- and Battery-Powered Applications
Ruggedized in an ultra-high vacuum for enhanced thermal insulation, the EX-423 delivers stability and RF performance

Next‑Generation 100/1000BASE‑T1 Single Pair Ethernet PHYs Integrate MACsec Security, Time Sensitive Networking and Functional Safety
Microchip’s LAN878x and LAN888x PHY families enable secure, scalable and deterministic Ethernet connectivity for automotive and industrial systems

New BZPACK mSiC® Power Modules Are Designed for Demanding Applications in Harsh Environments
The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC MOSFET families

Mythic® Selects memBrain™ Technology from Silicon Storage Technology® for its Next Generation of Ultra-Low-Power Analog Processing Units
With SuperFlash® memory, Mythic’s APU achieves 120 TOPs/watt performance for low-power AI inferencing


Company of the week

Mitutoyo

Interesting video


productronica 2025


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE

Address Book


Mitutoyo


Vox Power


Texas Instruments


STMicroelectronics


Future Electronics


TELEDYNE Vision Solution


Vexlum


Mitsubishi Electric


Parker Hannifin


QUECTEL


Infineon Technologies AG


Seica


NeoCortec


PULSIV


MikroElektronika d.o.o.


Panasonic Industry


Cambridge GaN Devices


Traco Power


BALLUFF


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU



Calendary
electronica 2026, München, DE, 10.-13.11.2026

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813