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Develop Low-power Wireless Sensor Nodes with the Industry’s Smallest Regulatory-certified Sub-GHz Module
Microchip’s SAM R30 module provides multiple years of battery life for robust proprietary networks while reducing time to market

Designers of wireless, space-constrained sensor nodes require connectivity solutions that minimize size and provide multiple years of battery life. Microchip Technology Inc. (Nasdaq: MCHP) today announced the industry’s smallest IEEE 802.15.4-compliant module that combines an ultra-low-power microcontroller (MCU) with a sub-GHz radio, accelerating time to market and providing long-lasting battery life in wireless-networked sensors. At half the size of the next smallest module on the market, the SAM R30 module meets the needs of space-conscious designs such as home automation sensors and controls.

Based on IEEE 802.15.4, the SAM R30 module supports proprietary networks that can be easily customized and configured. This is ideal for applications where interoperability is not desired due to their inherent vulnerability to remote attacks, such as alarm systems, building automation, smart cities and industrial sensor networks. A key advantage of an IEEE 802.15.4-based network is that member devices can sleep for extended periods of time and remain part of the network. The SAM R30 module features ultra-low-power sleep modes, with wake from General-Purpose Input/Output (GPIO) or its built-in Real-Time Clock (RTC) while consuming approximately 800 nA. Devices can sleep for years, only waking as needed to transmit data.

Compact sensor designs can significantly reduce installation components and simplify device deployment. Applications often rely on simple double-sided tape for mounting, making decreasing the size of the sensor a priority. The SAM R30 module measures just 12.7 x 11 mm and includes the necessary features to drive any remote connected sensor, thereby eliminating the need for a separate MCU in the design. The device also offers up to 256 kilobytes (KB) of Flash and 40 KB of RAM, as well as serial data interfaces, USB, and digital and analog I/O for advanced sensor development.

Operating in the sub-GHz RF spectrum, the SAM R30 module delivers two times the connectivity range and better propagation through walls and floors than similarly powered devices using the 2.4 GHz frequency band. This robustness is critical in applications such as leak detection, where the sensor may be buried deep in a remote cabinet, or for pool and spa controllers, which require reliable sub-GHz solutions that can communicate through exterior walls.  

The SAM R30 module is certified with the Federal Communications Commission (FCC), Industry Canada (IC) and Radio Equipment Directive (RED), enabling designers to reduce time to market and RF testing certification costs. Microchip provides developers the flexibility to implement a proprietary point-to-point, star or self-healing mesh network configurations with the free MiWi™ protocol stack.

“The Internet of Things consists of millions of battery-powered sensors that rely on low-power operation and reliable wireless performance,” said Steve Caldwell, vice president of Microchip’s Wireless Solutions business unit. “The SAM R30 certified module meets these needs while also providing a way for developers to build more compact designs and accelerate time to market.”

The SAM R30 module joins Microchip’s IEEE 802.15.4-compliant wireless portfolio. With devices that meet the unique needs of a variety of applications, developers can select a single-chip 32- or 48-pin SAM R30 System-in-Package (SiP) for flexible design layout or the certified SAM R30 module for fastest time to market.

Development Tools

Developers can begin prototyping with the ATSAMR30M-XPRO Extension Development Board, supported by the Atmel ICE Debugger/Programmer (ATMEL-ICE) and the easy-to-use Atmel Studio 7 Integrated Development Environment with demo code examples supporting each network configuration.

Pricing and Availability

The SAM R30 module (ATSAMR30M18) is available now starting at $4.29 in 1,000-unit quantities. The ATSAMR30M-XPRO Extension Development Board (AC164159) is available for $38 each. For additional information, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s website. To purchase products mentioned here, visit Microchip’s purchasing portal or contact an authorized distributor.

2019041004 / 13.04.2019 / Electronic-components / Microchip Technology Inc. /

Microchip and Marelli Pioneer Open-Standard Display Connectivity Solution for Software-Defined Vehicles
Solution streams graphics and videos from centralized compute systems to automotive displays using standards-based ASA Motion Link connectivity

Plug-and-Play 90W PoE Solution Streamlines Industrial IoT Deployments
Microchip’s industrial-grade Power over Ethernet (PoE) midspans enable device deployment wherever needed, without any switch replacements or upgrades

Microchip Technology, in Collaboration With Micron Technology, Demonstrates High-Performance PCIe® Gen 6 Storage Architecture for AI and Data Center Infrastructure
Switchtec™ PCIe Switches and Micron® 9650 NVMe® solid state drives (SSDs) leverage next generation interface technology to deliver increased bandwidth, low latency, and scalable storage connectivity

Microchip Advances Neural Network Implementation with VectorBlox™ 3.0 Accelerator Software Development Kit
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XpressConnect™ PCIe® 6.0 and CXL 3.1 Retimers Address Latency and Signal‑Integrity Challenges in AI Data Centers
Strengthening Microchip Technology’s data center solutions portfolio, the retimers support high‑bandwidth architectures while helping reduce integration complexity

Essential Performance and Real-time Control Without the Baggage
Microchip’s dsPIC33CK Value Line DSCs offer streamlined design for cost-sensitive applications and consistent pricing regardless of order size

Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers
New silicon carbide modules deliver the required thermal performance and efficiency for SSTs to increase power available for token generation

New EX‑423 Evacuated Miniature Crystal Oscillator for Critical Timing in Low- and Battery-Powered Applications
Ruggedized in an ultra-high vacuum for enhanced thermal insulation, the EX-423 delivers stability and RF performance

Next‑Generation 100/1000BASE‑T1 Single Pair Ethernet PHYs Integrate MACsec Security, Time Sensitive Networking and Functional Safety
Microchip’s LAN878x and LAN888x PHY families enable secure, scalable and deterministic Ethernet connectivity for automotive and industrial systems

New BZPACK mSiC® Power Modules Are Designed for Demanding Applications in Harsh Environments
The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC MOSFET families

Mythic® Selects memBrain™ Technology from Silicon Storage Technology® for its Next Generation of Ultra-Low-Power Analog Processing Units
With SuperFlash® memory, Mythic’s APU achieves 120 TOPs/watt performance for low-power AI inferencing

New Power Module Enhances AI Data Center Power Density and Efficiency
Microchip’s MCPF1525 power module with PMBus™ delivers 25A DC-DC power, stackable up to 200A


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