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congatec launches 100 Watt ecosystem for embedded edge and micro servers
Maximum Performance for COM Express Type 7 Servers

congatec – a leading vendor of standardized and customized embedded computer boards and modules – launches its new 100 Watt ecosystem for embedded edge and micro servers at CIIF 2019 Shanghai (Hall 6.1H, Booth A112) today. The ecosystem is designed for embedded edge and micro servers that increasingly utilize 65-100 Watt COM Express Type 7 Server-on-Module performance for most cost-efficient scalability. It initially targets the recently launched conga-B7E3 modules featuring 3 GHz dual-die processors of the AMD EPYC Embedded 3000 series that supports a maximum TDP of 100 Watt, up to 16 cores and 32 threads. These world’s first 100 Watt Server-on-Modules in the COM Express Basic form factor (95 x 125 mm) can now get equipped with new heat spreaders and heatpipe adapters for an efficient heatpipe cooling even of extremely low profile 1U servers. By designing systems in such a way that does not use rotating fans, it is possible to develop extremely robust embedded servers that are suitable for numerous applications at the IoT/Industry 4.0 edge.  

Use cases for the 100 Watt ecosystem for embedded edge and micro servers include 5G telecom cloudlets, Industry 4.0 servers, smart robot cell servers with collaborative robotics, autonomous robotic and logistics vehicles with high speed vision and other situational awareness sensors. The ecosystem is further suitable for virtualized on-premise equipment in harsh environments to perform functions such as industrial routing, tactile internet, firewall security and intrusion detection systems, as well as VPN technologies – optionally in combination with various real-time controls and neural network computing for Artificial Intelligence (AI). 

“Embedded edge servers must meet ever increasing multifunctional performance requirements while operating in harsh environmental conditions where shocks and vibration are common. Rugged fanless system designs are thus required. Until today, this ecosystem was limited to a performance class of up to approximately 65 Watt. Now, congatec has extended the capabilities of fanless designs to conduction cooled 100 Watt systems. This enables an impressive performance boost of 53% for rugged fanless COM Express Type 7 designs,” explains Nano Chu, R&D Manager at congatec in Taipei. 

In addition to the new cooling solutions, the 100 Watt ecosystem also includes starter kits with the two different application-ready server-grade carrier boards  conga-X7EVAL and conga-STX7 that, among other things, execute four 10 GbE interfaces, which are server-compatible with SFP+ cages for both copper and fiber optic cables. Exemplifying edge server rack and box system designs, the kits can be modified to customer specifications. Relevant hardware engineering services for embedded edge server platforms round off the congatec 100 Watt ecosystem for Server-on-Modules.  

Notable software features of the 100 Watt ecosystem include support for real-time configurations to avoid latencies caused by processor-side TDP management and, above all, support for the comprehensive RAS (reliability, availability and serviceability) features common to all AMD EPYC Embedded 3000 processors. They enable the same efficient remote system monitoring, management and maintenance capabilities to optimize the total cost of ownership (TCO) in distributed deployments as known from commercial-grade data centers. Edge applications benefit from the hardware-integrated virtualization and leading-edge security features of the AMD EPYC Embedded 3000 SoC that includes Secure Boot System, Secure Memory Encryption (SME) and Secure Encrypted Virtualization (SEV), as well as a secure migration channel between two SEV-capable platforms. Support is also provided for IPsec with integrated crypto acceleration. As a consequence, even the server administrator does not have access to such an encrypted Virtual Machine (VM). This is very important for the high security required by many edge server services, which must enable multi-vendor applications in Industry 4.0 automation while helping ward off sabotage attempts by hackers.
 

More information about congatec’s 100 Watt ecosystem for COM Express Type 7 Server-on-Modules can be found at:
https://www.congatec.com/en/technologies/com-express/com-express-type-7/amd-epyc-embedded-3000-eco-system.html 

2019102803 / 30.10.2019 / Tools / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

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