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congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications
See and understand

congatec – a leading vendor of embedded computing technology – presents its brand new workload consolidation kit for vision based situational awareness that is qualified by Intel as Intel® IoT RFP (Ready For Production) Kit. Based on a COM Express Type 6 module equipped with Intel® Xeon® E2 processor, the RFP kit has three virtual machines (VMs) built on Real-Time Systems’ hypervisor technology for workload consolidation in vision applications. One VM runs a vision based AI application on the basis of Intel® OpenVino® software for situational awareness, the second VM is real-time capable and runs deterministic control software, and the third VM operates a IIoT/Industry 4.0 gateway. The congatec kit designed in cooperation with Intel® and Real-Time Systems targets the next generation of vision based collaborative robotics, automation controls and autonomous vehicles that have to tackle multiple tasks in parallel, including situational awareness utilizing deep learning based AI algorithms.
 

The Real-Time Systems based virtual machines make it possible to consolidate the different tasks on a single edge computing platform, which ultimately saves costs. The Intel® OpenVino® software delivers the appropriate artificial intelligence for situational awareness. OEMs just need to load their control to the real-time VM and they are ready to enrich their real-time control with data from the situational awareness VM and to communicate in real-time with IIoT/Industry 4.0 counterparts to enable tactile internet controls.
 

“Workload consolidation demand is rapidly increasing in vision based situational awareness applications: Machine controls, collaborative robotics and autonomous vehicles need virtualization, as OEMs don’t want to assign the different control, vision and networking tasks to multiple dedicated systems,” explains Martin Danzer, Director Product Management at congatec.

 

The workload consolidation RFP kit unpacked

congatec’s ‘Intel® IoT RFP Kit’ for workload consolidation in vision based situational awareness applications includes a COM Express Type 6 module based platform with Intel® Xeon® E2 processor, a Basler vision camera, a pendulum controlled by a demo controller, and an Intel® Arria® 10 FPGA card from REFLEX CES. The platform has three pre-installed application ready VMs on the basis of Real-Time Systems’ hypervisor technology. One VM analyses videos on the basis of Intel® OpenVino® software, the second VM runs real-time Linux to control the balance of an inverted pendulum in real-time. The third partition hosts a gateway for IIoT/Industry 4.0 connectivity. More information about the new Intel® IoT RFP Kit for workload consolidation is available at:

https://marketplace.intel.com/s/offering/a5b3b000000ThjQAAS/realtime-workload-consolidation-starter-set

and https://www.congatec.com/workload-consolidation

Related Files
2020061701 / 17.06.2020 / Tools / congatec AG /

Intel Alder Lake Product Video
Check out the new congatec Alder Lake video showing you performance gains and improvements to accelerate the world of embedded and real-time edge computing systems.

A quantum leap in core count
congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors

congatec announces changes in top management to further accelerate company growth
Dr. Dirk Haft is new CEO, Daniel Jürgens new CFO

congatec opens virtual trade show booth for interactive information exchange
Round-the-clock accessibility

congatec and SYSGO join forces
Computer-on-Modules meet functional safety and security

Real-Time Over the Air
congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices

congatec and MATRIX VISION present PCIe based high-speed vision technology
Virtually latency free vision with up to 226.5 FPS

Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus
congatec celebrates the 15th anniversary of Qseven Computer-on-Modules with the introduction of the conga-QMX8-Plus, a brand new Qseven module based on the NXP i.MX 8M Plus application processor.

Brand new Qseven upgrade: NXP i.MX 8
New congatec module with i.MX 8M Plus gives Qseven designs a massive performance boost for the future

New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)
congatec introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor (condenamed Tiger Lake-H) for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules target the most demanding IoT gateway and edge computing applications.

Leading edge, in more than just bandwidth
congatec sets a new benchmark with the launch of 20 new Computer-on-Modules with 11th Gen Intel Core processors (formerly codenamed: Tiger Lake-H)

New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
congatec ntroduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.

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Laird Thermal Systems

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Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)


11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview


Address Book


Laird Thermal Systems


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MACH SYSTEMS s.r.o.


Pico Technology


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SECO S.p.A.


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The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



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