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Infineon adds 40 V device in PQFN to its OptiMOS™ Source-Down power MOSFET family
Contemporary power system designs demand high power density levels and small form factors to maximize system-level performance. Infineon Technologies AG tackles this challenge by focusing on system innovation with enhancements on the component level. Adding to the 25 V device introduced in February, Infineon now brings the OptiMOS™ 40 V low-voltage power MOSFET to the market.

It is packaged in the Source-Down (SD) PQFN with a 3.3 x 3.3 mm 2 footprint. The 40 V SD MOSFET primarily addresses SMPS for server, telecom, and OR-ing, as well as battery protection, power tool, and charger applications.

The SD package features silicon that is being flipped upside down inside of the component. With that, the source potential is connected to the PCB over the thermal pad instead of the drain potential. In the end, this variant can lead to a major reduction of R DS(on) by up to 25 percent compared to the current technology. The thermal resistance between junction to case (R thJC) is also significantly improved compared to the traditional PQFN packages. The SD OptiMOS can withstand high continuous currents of up to 194 A. Additionally, the optimized layout possibilities and the more efficient utilization of the PCB allow for greater design flexibility together with highest performance.

Availability

The OptiMOS SD 40 V low-voltage power MOSFET is available in two versions, standard and Center-Gate. The Center-Gate variant is optimized for parallel operation of multiple devices. Both variants in the PQFN 3.3 x 3.3 mm 2 package can be ordered now. More information is available at www.infineon.com/source-down.

2020110201 / 02.11.2020 / Electronic-components / Infineon Technologies AG /

Infineon launches next-generation ZVS flyback converter chipset for advanced USB-C PD adapters and chargers
The growing popularity of USB-C power delivery (PD) charging increases the demand for compatible chargers. Users now seek powerful yet compact adapters.

Infineon Lighting Shoe: Infineon develops worldwide unique shoe prototype with adidas that listens to music and reacts to it with lighting effects

Infineon’s single-chip solution for NFC lock applications enables KISS to take self-storage to the next level with new smart lock solution

Infineon introduces new automotive 60 V and 120 V OptiMOS™ 5 in TOLx packages for 24 V-72 V supplied high power ECUs
The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified. Therefore, the automotive market for Electronic Control Units (ECUs) powered by 24 V-72 V is expected to keep growing in the coming years.

Infineon presents highly integrated XENSIV™ 60 GHz radar sensor for consumer electronics, IoT applications, and healthcare devices

Engine management and pneumatic seat systems: Infineon launches two XENSIV™ barometric air pressure sensors

Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions

Infineon introduces a new single-stage flyback controller for battery charging applications, enabling hassle-free and scalable designs
Battery-powered appliances, one of the industry’s fastest-growing segments, require energy-efficient, robust, and cost-effective battery charging. For this reason Infineon Technologies AG extends its offering of AC-DC controller ICs by introducing the ICC80QSG single-stage PWM controller for flyback topologies.

Infineon’s CoolSiC™ devices support bi-directional inverter from Delta to let electric vehicles become emergency backup power

Infineon and Oxford Ionics join forces to develop leading Trapped Ion Quantum Processors
Infineon Technologies AG and Oxford Ionics announce a collaboration to build high-performance and fully integrated quantum processing units (QPUs).

Optimized CoolSiC™ MOSFETs 650 V in D²PAK for lowest losses in the application and highest reliability in operation

World’s first TPM 2.0 with open-source software stack cuts down security integration efforts in industrial, automotive and IoT applications
Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption and user authentication. Hence, they are crucial for connected industrial, automotive and other embedded devices.

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Friedrich Lütze GmbH


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ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.



Calendary
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DistribuTECH, 11.2.-13.2.2025, Dallas, TX

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The ISS Design Challenge ...

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Mouser Electronics Warehouse Tour with Grant Imahara


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