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Access Point WBE750
 
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Microchip’s High-Performance FPGA is First of its Kind to Achieve QML Class V in Ceramic Quad Flat Package
RTG4™ FPGAs offer a unique combination of radiation hardening by design, qualification to QML Class V and packaging that simplifies board design, inspection and assembly

Microchip Technology announced its RTG4™ Field Programmable Gate Array (FPGA) family is the first in a Ceramic Quad Flat Pack (CQFP) option to achieve qualification to the industry’s Qualified Manufacturers List (QML). The achievement will enable space system developers to create systems using more reliable packages that simplify the layout and routing of Printed Circuit Boards (PCBs) that are also easier to assemble and inspect.

“We have culminated years of testing, verification and flight heritage to offer a CQFP FPGA at the RTG4 FPGA density and performance level that is qualified to QML Class V, the highest reliability standard for spaceflight systems,” said Shakeel Peera, associate vice president of marketing for Microchip’s FPGA business unit. “Our high-speed radiation-tolerant RTG4 FPGAs were the first of their kind to achieve QML Class V qualification in any package type. They also were the first in their class to be offered in the 352-pin CQFP that is one of the most popular package types for space flight systems.”

Microchip’s CQFP package with 352 pins for RTG4 FPGAs simplifies system design in applications ranging from satellites and space probes to planet landers and vehicles. The CQFP package option is easier to assemble than Ceramic Column Grid Array packages, further improving reliability while enabling a more cost-effective system integration alternative to higher-pin-count alternatives. It is ideal for control applications that do not require a high number of inputs/outputs (I/Os) or need frequent switching and a high number of temperature cycles.

RTG4 FPGAs give space systems new high-speed signal-processing capabilities and leverage reprogrammable flash memory to provide greater immunity to configuration Single Event Upsets (SEUs) while consuming 40 to 50 percent less power than competing Static Random Access Memory (SRAM) FPGAs. RTG4 FPGAs feature 150,000 Logic Elements (LEs), 462 multipliers and 5.2 megabits (Mb) of memory. With this qualification, Microchip is now able to offer a full range of qualification and screening options for RTG4 FPGAs in the CQFP package suitable for a wide range of space missions from class 1 applications that require QML-V components, to low cost New Space constellations with relaxed screening requirements.

2020111802 / 22.11.2020 / Electronic-components / Microchip Technology Inc. /

Microchip Technology Releases Qi® v2.0 Standards-Compliant dsPIC33-Based Reference Design
Wireless dual-pad charging design supports both Extended Power Profile and Magnetic Power Profile with a single controller

Microchip Technology Releases Next Generation of Easily Configurable Enterprise Storage Backplane Management Processors for Data Center and Storage Applications
Updated EEC1005 family of Universal Backplane Management devices complies with latest SFF-TA-1005 V. 1.4 specifications

Microchip Launches New dsPIC® DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device
A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market

Microchip Expands its mSiC™ Solutions with the 3.3 kV XIFM Plug-and-Play mSiC Gate Driver to Accelerate the Adoption of High-Voltage SiC Power Modules
The highly integrated 3.3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration

Microchip’s Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
Cost-sensitive development platform helps student, beginner and seasoned designers work with emerging technologies

TimeProvider® 4500 Series Is the Industry’s First Grandmaster to Provide High-Speed Network Interfaces up to 25 Gbps
Extends Microchip’s IEEE®-1588 grandmaster portfolio and enables precise time accuracy to less than one nanosecond

Microchip Earns Certification in ISO/SAE 21434 Road Vehicle—Cybersecurity Engineering Standard from UL Solutions
Designing with certified security products can help Tier 1s and OEMs prove cybersecurity risk management compliance

The Next Evolutionary Step in Customizable Logic, Microchip Releases PIC16F13145 Family of MCUs
New Configurable Logic Block (CLB) module offers tailored hardware solutions and helps eliminate the need for external logic components

Microchip Launches 10 Multi-Channel Remote Temperature Sensors
MCP998x family represents one of the largest automotive-grade remote temperature sensor portfolios available from a single vendor

Next-Generation Family of Ethernet Switches Features Time Sensitive Networking and Scalable Port Bandwidths from 46 Gbps to 102 Gbps
Microchip’s LAN9694, LAN9696 and LAN9698 devices are integrated with High-availability Seamless Redundancy (HSR) and Parallel Redundancy Protocol (PRP) for ease of design

Microchip Launches AVR® EB Family of Microcontrollers to Reduce Noise, Vibration and System Harshness in BLDC Applications
Offers a smaller, more cost-effective solution for sophisticated waveform control with increased efficiency

Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing
Microchip’s SP1F and SP3F power modules are highly configurable in Silicon Carbide (SiC) or Silicon (Si) technology and now available with Press-Fit terminals

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electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


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NVIDIA


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Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
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