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DPI 750E
 
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Getting in the fast lane to Gen4
congatec starter set for COM-HPC™ with 11th Gen Intel® Core™ processors

congatec – a leading vendor of embedded and edge computing technology – presents a brand new COM-HPC™ starter set at embedded world 2021 DIGITAL. Optimized for modular system designs utilizing the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2x25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel® Core™ processor technology (code name Tiger Lake). This new high-end embedded module generation targets system engineers working on the broadband connected edge devices that are emerging in industrial IoT. Target markets include medical, automation, transportation and autonomous mobility, as well as vision based inspection and video surveillance systems, to name just a few. 

“Our new COM-HPC starter set – which can be ordered with a choice of individually compiled components from our COM-HPC ecosystem – puts engineers in the fast lane to Gen4 interface technology and further ultra fast connectivity,” says Martin Danzer, Director Product Management at congatec. “PCIe Gen4 doubles the throughput per lane compared to Gen3, which has massive effects on system designs as it enables engineers to double the number of connected extension devices. Handling all this under more complex design rules to achieve the required signal compliance makes it even more important to have a mature evaluation and benchmark platform for own system designs.” 

The starter set’s various Ethernet configuration options range from 8x 1GbE switching options and 2x 2.5 GbE including TSN support up to dual 10 GbE connectivity. congatec’s comprehensive AI support for MIPI-CSI connected cameras from Basler adds further application readiness to IIoT and Industry 4.0 connected embedded systems. AI and inferencing acceleration can be achieved with Intel® DL Boost running on the CPU vector neural network instructions (VNNI), or with 8-bit integer instructions on the GPU (Int8). Attractive in this context is the support of the Intel Open Vino ecosystem for AI, which comes with a library of functions and optimized calls for OpenCV and OpenCL kernels to accelerate deep neural network workloads across multiple platforms to achieve faster, more accurate results for AI inference. The starter set presented at embedded world 2021 DIGITAL is based on the following components of congatec’s COM-HPC ecosystem: 

ATX compliant carrier board conga-HPC/EVAL-Client

The ATX compliant carrier board conga-HPC/EVAL-Client incorporates all interfaces specified by the new COM-HPC Client standard and supports the extended temperature range from -40°C to +85°C. It comes with two massively performant PCIe Gen4 x16 connectors plus a variety of LAN data bandwidths, data transfer methods and connectors, including 2x 10 GbE, 2.5 GbE and 1GbE support. Over mezzanine cards, the carrier can run even higher-performance interfaces up to 2x25 GbE, making this evaluation platform a perfect fit for massively connected edge devices. The board supports the COM-HPC sizes A, B and C, and includes all interfaces engineers require for programming, firmware flashing and reset. 

New conga-HPC/cTLU COM-HPC Client module

The heart of the presented starter set for COM-HPC Client designs, the conga-HPC/cTLU computer-on-module, is available in different processor configurations. For each of these configurations, three different cooling solutions are available that fit the entire configurable 12-28W TPD range of the 11th Gen Intel® Core™ processors. 

Processor Cores/Threads Frequency at 28/15/12W TDP (Max Turbo) [GHz] Cache [MB] Graphics Execution Units Ext. Temp. range InBand ECC
Intel® Core™ i7-1185G7E 4/8 2.8/1.8/1.2 (4.4) 12 96 - -
Intel® Core™ i7-1185GRE     4/8 2.8/1.8/1.2 (4.4) 12 96 yes yes
Intel® Core™ i5-1145G7E     4/8 2.6/1.5/1.1 (4.1) 8 80 - -
Intel® Core™ i5-1145GRE 4/8 2.6/1.5/1.1 (4.1) 8 80 yes yes
Intel® Core™ i3-1115G4E     2/4 3.0/2.2/1.7 (3.9) 6 48 - -
Intel® Core™ i3-1115GRE     2/4 3.0/2.2/1.7 (3.9) 6 48 yes yes
Intel® Celeron® 6305E 2/2 1.8 (n/a) 4 48 - -

 

The product page of the conga-HPC/cTLU can be found at:
https://www.congatec.com/en/products/com-hpc/conga-hpcctlu/

The product page of the conga-HPC/EVAL can be found at:
https://www.congatec.com/en/products/accessories/conga-hpceval-client/

2021042702 / 27.04.2021 / Embedded / congatec AG /

congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs

congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change

congatec modules drive Intel Labs China’s Robot 4.0 platform for research and education
Making the robotic edge modular

congatec launches five new COM-HPC Server Size D modules with Intel Xeon D-2700 processors following the “less is more” approach
An advance into the world of mixed-critical real-time servers

congatec extends its 12th Gen Intel Core processor based COM-HPC and COM Express Computer-on-Module portfolio with seven more power-efficient new processor variants
Highly powerful, yet passively cooled

congatec and S.I.E launch co-creation services for the digitization of healthcare
Value partnership for creating medical edge computing systems that meet patient, data, and cybersecurity requirements

congatec to enter the functional safety market
Functional safe computing platforms for mixed-critical applications

Modular 5G cells for real-time communications
Real-time capable 5G cells with integrated edge servers are a key enabling technology for digital transformation, opening a plethora of new opportunities for IIoT, Industry 4.0 and critical infrastructure applications.

congatec simplifies Arm deployments with i.MX 8M Plus
Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified

TSN synchronized real-time over 5G
congatec introduces Computer-on-Modules for collaborative 5G robots and material handling systems at Smart Factory & Automation World

congatec introduces vehicle computing technology for smart mobility at Intertraffic Amsterdam
Embedded computing engines that put smart vehicle developers into the fast lane

congatec and S.I.E join in strategic partnership
Focus on OEM platforms for regulated industries

Company of the week

Intelliconnect (Europe) Ltd.

Interesting video


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


Address Book


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.


Pico Technology


Lynred


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RUTRONIK



Calendary
International Engineering Fair, 4.-7.10. 2022, Brno, CZ
sps - smart production solutions, 08.–10.11.2022, Nuremberg,
formnext, 15.-18.11.2022, Frankfurt am Main, DE
electronica 2022, 15.11.-18.11.2022, München, DE
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
AMPER 2023, 21.-23.3.2023, Prague, CZ
SMTconnect, 9.-11.5.2023, Nuremberg, DE
PCIM Europe, 9.-11.5.2023, Nuremberg, DE
sps Italia, 13.-15.5.2023, Fiere di Parma, IT
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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