Address Book
 

Friedrich Lütze GmbH
 

Analog Devices
 

ASRock Industrial
 

NVIDIA
 

Yamaichi Electronics USA Inc.
 

PICMG
 

Laird Thermal Systems
 

HARTING
 

Jenoptik
 

A.P.O. - ELMOS v.o.s.
 

MACH SYSTEMS s.r.o.
 

Pico Technology
 

Lynred
 

Advantech
 

EBV

19.05.2022 1:53:30
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
IRE-Q12
 
120W eighth brick DC-DC converters for r


Microchip Announces the Expansion of Its Radiation-Hardened Arm Microcontroller (MCU) Family for Space Systems
Designers can benefit from another step in the Arm Cortex-M7-based system-on-chip (SoC) commercial off-the-shelf (COTS) to rad-hard scalable solutions with the addition of embedded analog capabilities

Deep space initiatives including planetary exploration, orbiter missions and space research require innovative spacecraft system technology providing connectivity and processing. To enable system designers better integration and higher performance while reducing development costs and time to market, COTS technologies and scalable solutions are increasingly used in space applications. Microchip Technology Inc. (Nasdaq: MCHP) today announced the qualification of its SAMRH71 Arm-based microprocessor (MPU) and the availability of the SAMRH707 microcontroller (MCU), both implementing ArmÒ CortexÒ-M7 SoC radiation-hardened technology.

“Spacecraft and satellites are expanding in complexity to provide commercial and military operators with robust new communication and data capabilities, greater reliability and faster speeds, while the operators continuously seek to reduce cost, size and weight,” said Bob Vampola, associate vice president of Microchip’s aerospace and defense business unit. “In this environment, lowering system development costs while enabling greater capabilities and space system integration are ever more critical.”

Microchip’s SAMRH71 and SAMRH707 devices were developed with the support of the European Space Agency (ESA) and Centre National D’Etudes Spatiales (CNES), the French space agency, to further research and program initiatives.

“The introduction of Arm technologies for space applications opens up new perspectives by enabling the use of the same ecosystem well in place in the consumer and industrial sectors,” said David Dangla, VLSI Components Expert at CNES. “The SAMRH71 is the first Arm Cortex M7-based rad-hard microprocessor available today on the market. It offers developers the simplicity of a single-core processor and the performance of an advanced architecture without having to implement heavy mitigation techniques as is required for non-space components.”

“Integration of digital-to-analog converters and analog-to-digital converters together with a powerful processor core is a key requirement for addressing new challenges in aerospace applications,” said Kostas Marinis, Onboard Computers Engineer at ESA. “With the SAMRH707, Microchip provides easy-to-use capabilities in cost-effective, radiation-hardened MCUs.”

Relying on the standard Arm Cortex-M7 architecture and the same peripherals as automotive and industrial processors, the SAMRH71 and SAMRH707 provide system development cost and schedule optimization by leveraging standard software and hardware tools from the consumer devices.

The SAMRH71, a radiation-hardened variant of Microchip’s COTS automotive SoC technology, provides a combination of space connectivity interfaces along with high-performance architecture with more than 200 Dhrystone MIPS (DMIPS). Designed for high-level radiation performance, extreme temperatures and high reliability, the SAMRH71’s Arm Cortex-M7 core is coupled with high-bandwidth communication interfaces such as SpaceWire, MIL-STD-1553, CAN FD and Ethernet with IEEE 1588 Generalized Precision Time Protocol (gPTP) capabilities. The device is fully ESCC qualified with support from CNES and compliant with MIL standard Class V and Q high-reliability grades, allowing systems to meet strict compliance requirements.

Extending the portfolio of Microchip’s radiation-hardened Arm Cortex-M7-based MCUs, the SAMRH707 device provides analog functions on top of a >100 DMIPS processor unit with Digital Signal Processing (DSP) capabilities, combined with space connectivity interfaces in a small footprint designed for high-level radiation performance, extreme temperatures and high reliability. The SAMRH707 enables a high level of integration embedding Static Random Access Memory (SRAM) and flash memory, high-bandwidth communication interfaces including SpaceWire, MIL-STD-1553 and CAN FD, along with analog functions such as a 12-bit Analog-to-Digital Converter (ADC) and Digital-to-Analog Converter (DAC).

With space-designed MCUs, MPUs and Field Programmable Gate Arrays (FPGAs), Microchip provides critical elements for the development of new systems. Microchip’s total system solutions span space-qualified, radiation-hardened and radiation-tolerant power, timing and clock devices, as well as connectivity and memory solutions.

Development Tools

To speed system design, developers can use the SAMRH71F20-EK and SAMRH707F18-EK evaluation boards. Microchip’s full ecosystem supports its SAMRH707 and SAMRH71 space processors and includes MPLABÒ Harmony tools suite and third-party software services for space applications. Both Microchip devices are supported by the company’s Integrated Development Environment (IDE) for developing, debugging and software libraries. The devices are supported in MPLAB Harmony version 3.0.

Availability

The SAMRH71 ceramic package device is available in volume production quantities with QMLQ (SAMRH71F20C-7GB-MQ) and QMLV (SAMRH71F20C-7GB-SV) equivalent qualification levels. For applications requiring high volumes and cost-optimized structures, the SAMRH71 is available for printed circuit board design or evaluation in Ball Grid Array (BGA) plastic packaging. The SAMRH707 in a CQFP164 ceramic package is sampling today (SAMRH707F18A-DRB-E).

For additional information or to purchase products mentioned here, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s website.

2021043001 / 30.04.2021 / Electronic-components / Microchip Technology Inc. /

Microchip Introduces Industry’s Highest-Performance 16-Channel PCIe® Gen 5 Enterprise NVMe® SSD Controller
The Flashtec® NVMe 4016 controller enables unparalleled performance and a rich "cloud-ready" feature set including industry-leading security features.

Industry’s Only Family of Standard Non-Hybrid Space-Grade Power Converters Now Includes 28 Volt (V)-Input Radiation-Tolerant Options
Microchip’s alternatives to inflexible hybrid-style converters improve design flexibility while reducing system size, cost and development time

New In-Circuit Emulator (ICE) Boosts Productivity with Feature-Rich Programming and Debugging
Microchip’s MPLAB ICE 4 In-Circuit Emulator is a full emulation, programming and debugging system featuring wireless connectivity, power debugging and real-time code profiling using trace

High-Precision Voltage Reference IC Provides Very-Low Drift for Extended-Temperature Automotive Applications
New device completes Microchip’s family of Vref products providing increased reliability and AEC-Q100 qualification

Microchip and Acacia Collaborate to Enable Market Transition to 400G Pluggable Coherent Optics for Data Center Routing, Switching and Metro OTN Platforms
Solutions enable encrypted 100/400 GbE, FlexE and Flexible OTN interfaces for 400ZR, OpenZR+ and Open ROADM applications

Reduce Switching Losses up to 50% While Accelerating Time to Market with the First Fully Configurable Digital Gate Driver for Silicon Carbide MOSFETs – Now Production Ready
New technology enables electric buses and other e-transportation power systems to meet and exceed stringent environmental conditions while maximizing efficiency

Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI
META-DX2L enables routers, switches and line cards to double their bandwidth by transitioning to 112G PAM4 interface rates

Smart High Level Synthesis (HLS) Tool Suite Enables C++ Based Algorithm Development Using Microchip’s PolarFire® FPGA Platform
Enhances Accessibility to PolarFire FPGAs for Hardware Acceleration in Edge Compute Systems

New Chip Scale Atomic Clock (CSAC) Provides Wider Operating Temperatures, Faster Warm-up and Improved Frequency Stability in Extreme Environments
Microchip’s SA65 CSAC for military and industrial systems features ultra-high precision and low power consumption

New I2C Serial EEPROM Introduces 3.4MHz High-Speed Mode Operation, Software Write-Protection and Factory Programmed Serial Numbers
Industry First 3.4 MHz I2C Serial EEPROM Closes the Gap in Trade-Offs Between SPI and I2C Protocols

Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems
Microchip’s new low-density PolarFire® devices consume half the static power of alternatives while providing world’s smallest thermal footprint

First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
Microchip’s BL1, BL2 and BL3 family, developed with the Clean Sky consortium, is qualified to stringent aerospace standards for AC-to-DC and DC-to-AC power conversion

Company of the week

Friedrich Lütze GmbH

Interesting video


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


Address Book


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


INTEL


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU



Calendary
AMPER 2022, BRNO - CZ, 17.-20.5.2022
HANNOVER MESSE 2022, 30.5-2.6. 2022
CTiS Shanghai, 31.5.-2.6.2022
automatica 2022, München, 21.6.-24.6.2022
electronica 2022, 15.11.-18.11.2022, München, DE
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813