Address Book
 

Intelliconnect (Europe) Ltd.
 

KIOXIA Europe GmbH
 

Antenova Ltd
 

Friedrich Lütze GmbH
 

Analog Devices
 

ASRock Industrial
 

NVIDIA
 

Yamaichi Electronics USA Inc.
 

PICMG
 

Laird Thermal Systems
 

HARTING
 

Jenoptik
 

A.P.O. - ELMOS v.o.s.
 

MACH SYSTEMS s.r.o.
 

Pico Technology

25.09.2022 0:07:09
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
IRE-Q12
 
120W eighth brick DC-DC converters for r

congatec SMARC 2.1 modules with NXP i.MX 8M Plus processor
Low power flagship for embedded vision and AI

congatec – a leading vendor of embedded and edge computing technology – presents its brand new low power SMARC 2.1 Computer-on-Modules with NXP i.MX 8M Plus processor for industrial edge analytics, embedded vision and artificial intelligence (AI) at embedded world 2021 DIGITAL. With its machine and deep learning capabilities, the new ultra low power conga-SMX8-Plus module allows industrial embedded systems to see and analyze their surroundings for situational awareness, visual inspection, identification, surveillance and tracking as well as gesture-based contactless machine operation and augmented reality.

Technical highlights of the Arm Cortex-A53 based quad-core processor platform include the integrated neural processing unit (NPU) for AI computational power, and the image signal processor (ISP) for parallel real-time processing of high resolution images and video streams from the two integrated MIPI-CSI camera interfaces. The extensive ecosystem of this new SMARC module – such as application-ready 3.5-inch carrier boards as well as Basler camera and AI software stack support – complements the product launch for a fast proof of concept. Vertical markets for these credit card sized low power vision and AI modules can be found anywhere from smart farming and industrial manufacturing to retail, and from transportation to smart cities and smart buildings. 

“If engineers leverage the rich and highly efficient feature set of the new SMARC modules along with our extensive ecosystem and implement further application-specific functions via PCIe Gen 3 as well as 2x USB 3.0 and 2x SDIO, they have a highly reliable and robust 2-6 Watt low power platform for vision and AI. Depending on the variant, the new modules can even be used in the extended temperature range of -40°C to 85°C,” explains Martin Danzer, Director Product Management at congatec.

With its various specialized processing units, the new i.MX 8M Plus processor based SMARC module from congatec enables impressively responsive embedded vision and AI applications with an extremely low power envelope. Advantages include:

  • The NPU adds 2.3 TOPS of dedicated AI computational power to the four powerful multi-purpose Arm Cortex-A53 processor cores.
  • The integrated ISP processes full HD video streams with up to 3x 60 frames per second for video enhancement.
  • The high-quality DSP enables local speech recognition without any cloud connection.
  • The Cortex-M7, which can also be used as a fail-safe unit, provides real-time control together with a time synchronized networking capable Ethernet port.
  • Next to an encryption module (CAAM) for hardware-accelerated ECC and RSA encryption, the Arm TrustZone also integrates the Resource Domain Controller (RDC) for isolated execution of critical software, and the secure High Assurance Boot mode to prevent the execution of unauthorized software during boot.

The feature set in detail

The new SMARC 2.1 modules for vision and AI applications feature four quad-core Arm Cortex-A53 based NXP i.MX 8M Plus processors for the industrial (0°C to +60°C) or extended temperature ranges (-40°C to +85°C) as well as in-line ECC for up to 6 GB LPDDR4 memory. The modules can drive up to three independent displays and provide hardware accelerated video decoding and encoding including H.265 so that high resolution camera streams delivered by two integrated MIPI-CSI interfaces can be sent directly to the network. For data storage, engineers will find onboard up to 128 GB eMMC, which can also operate in safe pSLC mode. Peripheral interfaces include 1x PCIe Gen 3, 2x USB 3.0, 3x USB 2.0, 4x UART as well as 2x CAN FD and 14x GPIO. For real-time networking, the module offers 1x Gbit with TSN support plus conventional Gbit Ethernet. An optional M.2 WiFi and Bluetooth LE card soldered on the module adds wireless connectivity. 2x I2S for sound rounds off the feature set. The supported operating systems include Linux, Yocto 2.0 and Android.

Further information on the new congatec SMARC Computer-on-Module conga-SMX8-Plus can be found at:
https://www.congatec.com/en/products/smarc/conga-smx8-plus/

To see congatec’s complete i.MX 8 portfolio, please visit www.congatec.com/imx8

2021050201 / 02.05.2021 / Embedded / congatec AG /

congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs

congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change

congatec modules drive Intel Labs China’s Robot 4.0 platform for research and education
Making the robotic edge modular

congatec launches five new COM-HPC Server Size D modules with Intel Xeon D-2700 processors following the “less is more” approach
An advance into the world of mixed-critical real-time servers

congatec extends its 12th Gen Intel Core processor based COM-HPC and COM Express Computer-on-Module portfolio with seven more power-efficient new processor variants
Highly powerful, yet passively cooled

congatec and S.I.E launch co-creation services for the digitization of healthcare
Value partnership for creating medical edge computing systems that meet patient, data, and cybersecurity requirements

congatec to enter the functional safety market
Functional safe computing platforms for mixed-critical applications

Modular 5G cells for real-time communications
Real-time capable 5G cells with integrated edge servers are a key enabling technology for digital transformation, opening a plethora of new opportunities for IIoT, Industry 4.0 and critical infrastructure applications.

congatec simplifies Arm deployments with i.MX 8M Plus
Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified

TSN synchronized real-time over 5G
congatec introduces Computer-on-Modules for collaborative 5G robots and material handling systems at Smart Factory & Automation World

congatec introduces vehicle computing technology for smart mobility at Intertraffic Amsterdam
Embedded computing engines that put smart vehicle developers into the fast lane

congatec and S.I.E join in strategic partnership
Focus on OEM platforms for regulated industries

Company of the week

Intelliconnect (Europe) Ltd.

Interesting video


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


Address Book


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


INTEL


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK



Calendary
International Engineering Fair, 4.-7.10. 2022, Brno, CZ
sps - smart production solutions, 08.–10.11.2022, Nuremberg,
formnext, 15.-18.11.2022, Frankfurt am Main, DE
electronica 2022, 15.11.-18.11.2022, München, DE
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
AMPER 2023, 21.-23.3.2023, Prague, CZ
SMTconnect, 9.-11.5.2023, Nuremberg, DE
PCIM Europe, 9.-11.5.2023, Nuremberg, DE
sps Italia, 13.-15.5.2023, Fiere di Parma, IT
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813