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Microchip Boosts Gallium Nitride (GaN) Radio Frequency (RF) Portfolio with Ka-band Monolithic Microwave Integrated Circuit (MMIC) with High Linearity for SatCom Terminals
The GMICP2731-10 helps maintain signal fidelity by allowing Earth stations to transmit at high RF levels without sacrificing the quality of the signal

Satellite communication systems use complex modulation schemes to achieve the blazingly fast data rates required to deliver video and broadband data. To attain this, they must deliver high RF output power while simultaneously ensuring the signals retain their desired characteristics. The new GMICP2731-10 GaN MMIC power amplifier announced today by Microchip Technology Inc. (Nasdaq: MCHP) helps meet both of these requirements.

The new device, Microchip’s first GaN MMIC, is designed for use in commercial and defense satellite communications, 5G networks and other aerospace and defense systems.

The GMICP2731-10 is fabricated using GaN-on-Silicon Carbide (SiC) technology. It delivers up to 10W of saturated RF output power across the 3.5 GHz of bandwidth between 27.5 to 31 GHz. Its power-added efficiency is 20%, with 22 dB of small-signal gain and 15 dB of return loss. A balanced architecture allows the GMICP2731-10 to be well matched to 50-ohms and includes integrated DC blocking capacitors at the output to simplify design integration.

“As communication systems employ complex modulation schemes such as 128-QAM and as the power of solid-state power amplifiers (SSPAs) trends ever upwards, RF power amplifier designers have the difficult challenge of finding higher power solutions while at the same time reducing weight and power consumption,” said Leon Gross, vice president of Microchip’s Discrete Products Group business unit. “GaN MMICs used in high power SSPAs can achieve greater than 30% lower power and weight as compared to their GaAs counterparts, which is a huge gain for satellite OEMS. This product delivers on the promise of GaN and enables the size, weight, power and cost OEMs are searching for.”

Microchip’s GMICP2731-10 complements the company’s existing portfolio of GaAs MMIC RF power amplifiers, switches, low-noise amplifiers, and Wi-Fi front-end modules, as well as a GaN-on-SiC High Electron Mobility Transistor (HEMT) driver and final amplifier transistors for radar systems.

Development Tools

Microchip provides board design support to help with design-ins, as does the company’s distribution partners. The company also provides compact models for the GMICP2731-10, which allow customers to model the performance and expedite the design of the power amplifier in their systems more easily.

Availability

The GMICP2731-10 is available today in volume production. For additional information, contact a Microchip sales representative or visit Microchip’s website. To purchase the GMICP2731-10, visit our purchasing portal or contact a Microchip authorized distributor.

2021062301 / 23.06.2021 / Electronic-components / Microchip Technology Inc. /

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Microchip Technology Releases Next Generation of Easily Configurable Enterprise Storage Backplane Management Processors for Data Center and Storage Applications
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Microchip Launches New dsPIC® DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device
A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market

Microchip Expands its mSiC™ Solutions with the 3.3 kV XIFM Plug-and-Play mSiC Gate Driver to Accelerate the Adoption of High-Voltage SiC Power Modules
The highly integrated 3.3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration

Microchip’s Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
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TimeProvider® 4500 Series Is the Industry’s First Grandmaster to Provide High-Speed Network Interfaces up to 25 Gbps
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Microchip Earns Certification in ISO/SAE 21434 Road Vehicle—Cybersecurity Engineering Standard from UL Solutions
Designing with certified security products can help Tier 1s and OEMs prove cybersecurity risk management compliance

The Next Evolutionary Step in Customizable Logic, Microchip Releases PIC16F13145 Family of MCUs
New Configurable Logic Block (CLB) module offers tailored hardware solutions and helps eliminate the need for external logic components

Microchip Launches 10 Multi-Channel Remote Temperature Sensors
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Next-Generation Family of Ethernet Switches Features Time Sensitive Networking and Scalable Port Bandwidths from 46 Gbps to 102 Gbps
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Microchip Launches AVR® EB Family of Microcontrollers to Reduce Noise, Vibration and System Harshness in BLDC Applications
Offers a smaller, more cost-effective solution for sophisticated waveform control with increased efficiency

Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing
Microchip’s SP1F and SP3F power modules are highly configurable in Silicon Carbide (SiC) or Silicon (Si) technology and now available with Press-Fit terminals

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