Address Book
 

Pico Technology
 

Lynred
 

Advantech
 

EBV
 

SECO S.p.A.
 

Crowd Supply
 

Digi-Key Electronics
 

Durakool
 

KEMET
 

INTEL
 

CODICO
 

Future Electronics
 

Foremost Electronics
 

Littelfuse
 

Mouser Electronics

01.08.2021 0:07:34
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
IRE-Q12
 
120W eighth brick DC-DC converters for r

New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
congatec ntroduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.

 For more price sensitive applications, congatec also offers a cost optimized Intel® Celeron® processor based variant for the extended temperature range from 0°C to 60°C. Typical customers for the new range of Computer-on-Modules based on the Tiger Lake microarchitecture are OEMs of trains, commercial vehicles, construction machines, agricultural vehicles, self-driving robots and many other mobile applications in the most challenging outdoor and off-road environments. Shock and vibration resistant stationary devices are another important application area as digitization requires critical infrastructure protection (CIP) against earthquakes and other mission critical events. All these applications can now benefit from super-fast LPDDR4X RAM with up to 4266 MT/s and in-band error-correcting code (IBECC) for single failure tolerance and high data transmission quality in EMI critical environments.
 

The value package includes rugged mounting options for the COM and carrier bundle, active and passive cooling options, optional conformal coating for protection against corrosion due to moisture or condensation, a list of recommended carrier board schematics, and for highest reliability, shock and vibration resistant components for the extended temperature range. This impressive technical feature set is complemented by a comprehensive service offering that includes shock and vibration tests for custom system designs, temperature screening, and high speed signal compliance testing, along with design-in services, and all required training sessions which simplify the use of congatec’s embedded computer technologies.
 

The benefits in detail

Based on the new low-power high-density 11th Gen Intel® Core® SoCs, the new modules offer significantly greater CPU performance and nearly 3x higher GPU performance compared to their predecessors, along with state-of-the-art PCIe Gen4 support. The most demanding graphics and compute workloads benefit from up to 4 cores, 8 threads, and up to 96 graphics execution units for massive parallel processing throughput in an ultra-rugged shape. The integrated graphics not only supports 8k displays or 4x 4k; it can also be used as parallel processing unit for convolutional neural networks (CNN) or as an AI and deep learning accelerator. The CPU integrated Intel AVX-512 instruction unit with support for Vector Neural Network Instructions (VNNI) is another feature accelerating AI applications. Using the Intel OpenVINO™ software toolkit, which includes optimized calls for OpenCV, OpenCL™ kernels, and other industry tools and libraries, workloads can be extended across CPU, GPU and FPGA compute units to accelerate AI workloads, including computer vision, audio, speech, and language recognition systems.
 

The TDP is scalable from 12 W to 28 W, enabling fully sealed system designs with passive cooling only. The impressive performance of the ultra-rugged conga-TC570r COM Express Type 6 module has been made available in a real-time capable design including support for Time Sensitive Networking (TSN), Time Coordinated Computing (TCC) and RTS Realtime Systems’ hypervisor for virtual machine deployments and workload consolidation in edge computing scenarios.
 

The ultra-rugged COM Express Compact Type 6 11th Gen Intel® Core® (code name Tiger Lake) modules are available in the following standard configurations with customization options upon request:

Processor Cores/ Threads Frequency at 28/15/12W TDP,
(Max Turbo) [GHz]
Cache [MB] Graphics [Execution Units]
Intel® Core™ i7-1185GRE 4/8 2.8/1.8/1.2 (4.4) 12 96 EU
Intel® Core™ i5-1145GRE 4/8 2.6/1.5/1.1 (4.1) 8 80 EU
Intel® Core™ i3-1115GRE 2/4 3.0/2.2/1.7 (3.9) 8 48 EU
Intel® Celeron® 6305E 2/2 1.8 4 48 EU


Further information on the new conga-TC570r COM Express Compact module can be found here: www.congatec.com/en/products/com-express-type-6/conga-tc570r/

Information on further Intel Tiger Lake solutions from congatec can be found on the main landing page: https://congatec.com/11th-gen-intel-core/

2021071403 / 14.07.2021 / Embedded / congatec AG /

New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
congatec ntroduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.

congatec i.MX 8M Plus starter set for AI accelerated embedded vision applications
Fast track to NPU accelerated smart vision

congatec to expand its business in Korea
congatec announces the foundation of congatec Korea Ltd. to meet increasing customer demand in South Korea. The establishment of a new subsidiary underlines the importance of Korea for congatec’s global business success.

11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview
congatec Product Manager Andreas Bergbauer explains us his view of the congatec’s modules based on the 11th Gen Intel® Core™ processors (Intel Tiger Lake) feature high-performance CPU/GPU computer with integrated AI acceleration for critical applications that demand high-speed processing and computer vision.

congatec presents artificial intelligence platforms for medical equipment market
congatec technology makes healthcare smarter

How to mount congatec cooling solutions (COM Express Type 7, 6 and 2)
Keeping COMs cool - This video is a step by step guide on how to mount congatec cooling solutions on to COM Express Type 7, 6 and 2.

More power for low power 24/7 systems
congatec doubles performance with AMD Ryzen™ Embedded V2000 processor

congatec SMARC 2.1 modules with NXP i.MX 8M Plus processor
Low power flagship for embedded vision and AI

Getting in the fast lane to Gen4
congatec starter set for COM-HPC™ with 11th Gen Intel® Core™ processors

congatec to solve ruggedization challenges of edge server and client designs
Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC

ANYbotics’ ANYmal C robot is a multi-module machine
Rugged four-legged robot with three brains

First COM-HPC and next-gen COM Express
congatec fuels launch of 11th Gen Intel® Core™ processors with two great new design options

Company of the week

Pico Technology

Interesting video


11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview


ORNO - OR-WAT-419 Power Meter [electricity consumption calculator]


How to mount congatec cooling solutions (COM Express Type 7, 6 and 2)


Phoenix Contact Dialog Days - 12.-16.4.2021


Arduino LED filament clock


Address Book


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


INTEL


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics


Texas Instruments


Microchip Technology Inc.


ON Semiconductor


Molex, LLC


NeoPhotonics


Murata Manufacturing Co.,



Calendary
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813