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ITEC emerges as independent semiconductor equipment manufacturer in time to address semiconductor shortage with highest productivity chip-assembly systems
Fastest assembly and electrical test equipment; integrated smart manufacturing solutions using Big Data and machine learning for optimised Industry 4.0

ITEC, the semiconductor equipment manufacturer founded in 1991 by Philips (now Nexperia), today announced its launch as a separate independent entity. ITEC remains part of the Nexperia group. This move will allow ITEC to address the third-party market in time to serve the current semiconductor boom. It provides manufacturers worldwide access to disruptive manufacturing solutions that are built to last.

ITEC has always been at the forefront of semiconductor production. Comments General Manager, Marcel Vugts: “ITEC is rooted in semiconductor manufacturing, combining over 30 years of state-of-the-art equipment and automation expertise as partner to Philips, NXP and Nexperia. With an installed base of more than 2500 of the industry’s most advanced tools, ITEC is committed to embed the latest technologies and process expertise into tailored solutions that redefine manufacturing. We enable our customers to excel in quality, productivity, and sustainability with the lowest total cost of ownership.”

Currently, ITEC offers the following benchmark solutions for best-in-class semiconductor back-end manufacturing:

  • ADAT assembly equipment for die bond and chip sort - currently the fastest equipment of its type capable to process up to 20 dies per second, producing 1.5 million chips per system per day.
  • Parset test platform – enables the electrical parameter testing of small signal and power MOS devices at a rate up to 92,000 chips per hour.
  • Smart vision Inspection systems for semiconductor front-end and back-end manufacturing using deep learning technologies.
  • Factory Automation and Smart manufacturing – complete equipment control software suite, combining scheduling, optimization, traceability and analysis functions using ‘Big Data’ analytics and machine learning to enable leading Industry 4.0 production for mass volume semiconductor manufacturing.

Vugts concludes: “During ITEC’s history, annual production of discrete semiconductors on our equipment has grown from 4.5 billion in 1991 to over 90 billion products in 2020 – that represents ten devices for every citizen on the world, each year. With the current worldwide shortage in semiconductors and lead times lengthening, ITEC – now as an independent company – is ideally positioned to support the exponentially growing industry, redefining the world of manufacturing.”

About ITEC

ITEC was formed in 1991 as a division of Philips (subsequently NXP and Nexperia) to provide semiconductor, RFID and miniLED manufacturing equipment and systems. In 2021, ITEC became an independent company within the Nexperia group of companies. ITEC provides the highest productivity assembly, test, inspection and Smart manufacturing platforms, targeting mass volume manufacturing from small signal to power MOS devices. ITEC is headquartered in Nijmegen, the Netherlands, and has a large supply chain and customer support office in Hongkong.

2021071804 / 18.07.2021 / Various / NEXPERIA /

Nexperia obtains 100% ownership of Newport Wafer Fab, to be renamed Nexperia Newport.
Welsh semiconductor plant to focus on MOSFETs, IGBT, Analog and Compound Semiconductor Automotive-grade products

ITEC emerges as independent semiconductor equipment manufacturer in time to address semiconductor shortage with highest productivity chip-assembly systems
Fastest assembly and electrical test equipment; integrated smart manufacturing solutions using Big Data and machine learning for optimised Industry 4.0

First products from Nexperia’s new Manchester 8-inch wafer line are industry-leading Qrr Figure of Merit 80 V / 100 V MOSFETs
Nexperia announced that the first products to be made in the company’s new 8-inch wafer line in Manchester, UK, will be low RDS(on), low Qrr 80 V and 100 V MOSFETs using its latest NextPower silicon technology.

Nexperia invests $700 million in 2021/2022 to boost production capacity
New technologies, laboratories and people reflect confidence in the resurgent market for semiconductors worldwide

Low RDS(on) 40 V MOSFETs from Nexperia deliver highest power density for Automotive and Industrial applications
Class-leading SOA and Avalanche characteristics increase ruggedness and reliability

New Trench Schottky rectifiers from Nexperia increase efficiency for fast switching applications
AEC-Q101 approved devices up to 100 V and 20 A combine low switching losses and increased safe operating area

Nexperia’s 650 V GaN FETs enable 80 PLUS ® Titanium-class power supplies operating at 2 kW and above
Power GaN solution reduces component count, shrinks form factor & minimizes system costs

Nexperia announces new ESD protection devices for high-speed interfaces in automotive applications
High performance 4-channel ESD protection for automotive multimedia and video link applications offering ideal signal integrity

Nexperia and United Automotive Electronic Systems Co., Ltd. Agree Comprehensive Partnership for Gallium Nitride
Program will address the technical requirements for the power systems in electric vehicles

Nexperia extends LFPAK56D MOSFET line-up with AEC-Q101-qualified half-bridge package
Space-saving LFPAK56D half-bridge offers 60 % lower parasitic inductance and improved thermal performance for power train, motor control and DC/DC application

Nexperia announces plans to grow global production and increase R&D spend
New investments support global strategy to address growing demand for power semiconductors and boost GaN capabilities

Nexperia launches compact ‘2 in 1’ protection for high-speed data lines
Nexperia announced three new TrEOS protection devices that provide the most compact method to suppress ESD in USB3.2, HDMI2.1 and other high-speed data lines. The new PUSB3BB2DF, PESD5V0C2BDF, PESD4V0Z2BCDF devices provide best-in-class ESD protection and system robustness by combining high RF performance with very low clamping and very high surge capability.

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