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World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins
New packages enable large logic functions to be included in small form factor systems

Nexperia, the expert in essential semiconductors, today announced the world’s smallest and lowest profile 14,16, 20 and 24 pin packages for standard logic devices. For example, the 16 pin DHXQFN package is 45% smaller than the industry-standard DQFN16 leadless device. Not only has it a smaller footprint compared to competitors, but the new package also offers a 25% saving in PCB area.

Measuring just 2 mm x 2 mm (14 pin), 2 mm x 2.4 mm (16 pin), 2 mm x 3.2 mm (20 pin) and 2 mm x 4 mm (24 pin), the 0.4 mm pitch DHXQFN packages are only 0.45 mm high. The parts include: hex inverting Schmitt-triggers; 8-bit SIPO shift registers with output latches; 4-bit dual supply translating transceivers; octal buffer/line drivers; octal bus transceivers; and 8-bit dual supply translating transceivers.

Ashish Jha, Nexperia’s product manager comments: “Nexperia has a history of over 50 years developing standard logic parts, and we aspire to become the undisputed market leader during the next three years. These new packages are an example of the innovation we are bringing. Previously, incorporating large logic functions into a system with a small form factor was unthinkable. However, our new DHXQFN package enables complex functions such as 74HC595 shift registers to fit into space-sensitive applications like smartwatches, mobile devices and internet connected industrial devices.”

Furthermore, the small footprint of DHXQFN package enables devices to be placed closer to the bypass capacitor. This can be a significant advantage in designs with limited board space for glue logic parts, and also results in increased performance in high frequency applications since the traces between logic device and capacitor are shorter.

For more information, including product specs and datasheets, visit https://www.nexperia.com/products/analog-logic-ics/family/DHXQFN/

2021081201 / 11.08.2021 / Electronic-components / NEXPERIA /

USB4 ESD devices from Nexperia provide optimum balance of protection and performance
TrEOS based protection offers industry-leading insertion and return loss to help meet tight system budgets

Nexperia launches new portfolio of application specific MOSFETs (ASFETs) for automotive airbags
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.

Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks
Rugged and reliable devices are AEC-Q101 compliant and save board space

Nexperia’s 50 µA Zener diodes portfolio extends battery-time and saves PCB space
The comprehensive product range covers every application from 1.8 V to 75 V

Nexperia introduces a range of A-selection Zener diodes for precise voltage reference with the industry’s lowest tolerance of ±1%
The comprehensive product range covers every application from 2.4 V to 75 V

Nexperia expands its wide bandgap semiconductor offering with new family of high-performance Silicon Carbide (SiC) Diodes
Samples of industrial-grade 650 V, 10 A SiC Schottky diode now available. Parts with 1200 V / 6-20 A current range and automotive-grade parts also planned

Nexperia delivers extremely low clamping bidirectional ESD protection devices for USB4 standard interfaces
TrEOS diodes offer industry-leading insertion loss and return loss characteristics for more robust USB4TM data transmission

Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit

Nexperia launches ‘Power Live’ September 21-23 2021
Participate in live discussions on GaN, MOSFETs, power diodes and bipolar transistors for automotive and industrial applications; View on-demand video demos direct from Nexperia’s labs

Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch

Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost

World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins
New packages enable large logic functions to be included in small form factor systems

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