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Nexperia launches ‘Power Live’ September 21-23 2021
Participate in live discussions on GaN, MOSFETs, power diodes and bipolar transistors for automotive and industrial applications; View on-demand video demos direct from Nexperia’s labs

Nexperia, the expert in essential semiconductors, today announced ‘Power Live’, its second annual virtual conference from 21st-23rd September. Building on the success of last year’s inaugural event, the expanded three-day event will cover a wide range of subjects related to power electronics featuring GaN devices, MOSFETs, power diodes and bipolar transistors for automotive and industrial applications.

Session highlights will include:

  • Fully Electrothermal MOSFET Models
    A detailed preview of Nexperia’s new electrothermal MOSFET models, which can accurately represent static and dynamic characteristics of devices within simulation and reduce the risk of EMC issues ordinarily recognised late in the design process.

  • 650V GaN CCPAK evaluation
    Features and benefits of the upcoming evaluation board for benchmarking GaN CCPAK devices using double-pulse testing.

  • Designing with power MOSFETs in industrial applications
    Why and when you need a 500 A MOSFET, optimizing key characteristics, and managing in-rush current and hot SOA curves.

  • Schottky, Silicon Germanium or Recovery (PN) rectifiers?
    How to achieve extra efficiency and reliability in automotive applications like LED driver or solenoid drive by choosing the most suitable power diode.

The full agenda will include live presentations inviting engineers to discuss and contribute to some of today’s biggest challenges when designing with power components, as well as case studies and contributions from Nexperia’s valued partners. Attendees can also watch Nexperia’s resident power experts present the latest technology demos direct from the company’s worldwide labs throughout the event.

A GaN panel discussion attended by both Nexperia and industry experts, will close the ‘Power Live’ event on Thursday, 23rd September. This will be an open forum to discuss thoughts and influences of the technology and market. Contributions from participants are very welcome.

Commenting on ‘Power Live’ Robby Ferdinandus, Global Head of Marketing at Nexperia, says: “The feedback we got from our first event last year was excellent. More than 700 engineers registered to attend, and many said they found it especially invaluable to be able to engage with other like-minded people in the live sessions to discuss common design challenges.”

The full event schedule is released now. Questions for the GaN panel can be asked using the form on the registration page. Register free here.

2021083101 / 30.08.2021 / Training , Trade fairs, Evens / NEXPERIA /

USB4 ESD devices from Nexperia provide optimum balance of protection and performance
TrEOS based protection offers industry-leading insertion and return loss to help meet tight system budgets

Nexperia launches new portfolio of application specific MOSFETs (ASFETs) for automotive airbags
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.

Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks
Rugged and reliable devices are AEC-Q101 compliant and save board space

Nexperia’s 50 µA Zener diodes portfolio extends battery-time and saves PCB space
The comprehensive product range covers every application from 1.8 V to 75 V

Nexperia introduces a range of A-selection Zener diodes for precise voltage reference with the industry’s lowest tolerance of ±1%
The comprehensive product range covers every application from 2.4 V to 75 V

Nexperia expands its wide bandgap semiconductor offering with new family of high-performance Silicon Carbide (SiC) Diodes
Samples of industrial-grade 650 V, 10 A SiC Schottky diode now available. Parts with 1200 V / 6-20 A current range and automotive-grade parts also planned

Nexperia delivers extremely low clamping bidirectional ESD protection devices for USB4 standard interfaces
TrEOS diodes offer industry-leading insertion loss and return loss characteristics for more robust USB4TM data transmission

Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit

Nexperia launches ‘Power Live’ September 21-23 2021
Participate in live discussions on GaN, MOSFETs, power diodes and bipolar transistors for automotive and industrial applications; View on-demand video demos direct from Nexperia’s labs

Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch

Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost

World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins
New packages enable large logic functions to be included in small form factor systems

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electronica 2024, 12.11.-15.11.2024, Munich, DE


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