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Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit

Nexperia, the expert in essential semiconductors, has announced that one of its surface-mount device packages - the clip-bond FlatPower package CFP15B - has, for the first time, passed Board Level Reliability (BLR) testing for automotive applications by a leading Tier 1 supplier. Initially, it will be used in an engine control unit.

BLR provides a means of evaluating the robustness and reliability of semiconductor packages. The rigorous testing procedure is especially relevant in automotive applications, where safety and reliability are critical. Accreditation is particularly important as the industry shifts towards more electric and connected vehicles, increasing the complexity of onboard electronic systems.

“BLR verification is an important milestone,” said Guido Söhrn, Nexperia’s Product Manager for Power Bipolar Discretes. “The CFP15B represents the latest generation of thermally-enhanced, ultra-thin surface-mount devices. Its versatility and reliability make it the perfect choice for automotive components such as engine control units, transmission control units and many other safety applications such as braking.”

BLR verification confirmed that CFP15B exceeded twice the level of reliability performance that would be expected in accordance with AEC-Q101. Power temperature cycles, combining temperature cycling and intermittent operating life tests, saw the device achieve a qualification of 2,600 cycles. “The automotive sector presents some tough applications for surface-mount devices, and CFP15B proved itself under the harshest conditions,” added Guido Söhrn.

The CFP15B is manufactured from the highest-grade materials. It provides zero delamination in the areas around the leads, die and clip, therefore eliminating moisture ingress and increasing reliability.
CFP15B’s thermal resistance is reduced by featuring a solid copper clip. This optimizes the transfer of heat into the PCB, allowing compact PCB designs. The device is up to 60 per cent smaller than DPAK and SMx packages, with no compromise on thermal behavior. The small sizing presents huge space-saving options and therefore increases design flexibility.

The device package is used by different power diode technologies such as Nexperia’s Schottky or recovery rectifiers but can also be extended to Silicon Germanium power diodes or bipolar transistors. It offers significant product diversity, covering single/dual configuration and between 4-20 A, simplifying board design. 

For more information visit www.nexperia.com/cfp
You can also view Nexperia’s power diode technologies and CFP15B in action at Nexperia’s Power Live Event 21 – 23 September www.nexperia.com/power-live

2021091201 / 12.09.2021 / Electronic-components / NEXPERIA /

Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit

Nexperia launches ‘Power Live’ September 21-23 2021
Participate in live discussions on GaN, MOSFETs, power diodes and bipolar transistors for automotive and industrial applications; View on-demand video demos direct from Nexperia’s labs

Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch

Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost

World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins
New packages enable large logic functions to be included in small form factor systems

Nexperia’s new bipolar junction transistors in DPAK-package deliver high reliability performance for automotive and industrial applications
MJD series now available covering 2 – 8 A and 45 – 100 V and strengthening Nexperia’s power portfolio

Nexperia obtains 100% ownership of Newport Wafer Fab, to be renamed Nexperia Newport.
Welsh semiconductor plant to focus on MOSFETs, IGBT, Analog and Compound Semiconductor Automotive-grade products

ITEC emerges as independent semiconductor equipment manufacturer in time to address semiconductor shortage with highest productivity chip-assembly systems
Fastest assembly and electrical test equipment; integrated smart manufacturing solutions using Big Data and machine learning for optimised Industry 4.0

First products from Nexperia’s new Manchester 8-inch wafer line are industry-leading Qrr Figure of Merit 80 V / 100 V MOSFETs
Nexperia announced that the first products to be made in the company’s new 8-inch wafer line in Manchester, UK, will be low RDS(on), low Qrr 80 V and 100 V MOSFETs using its latest NextPower silicon technology.

Nexperia invests $700 million in 2021/2022 to boost production capacity
New technologies, laboratories and people reflect confidence in the resurgent market for semiconductors worldwide

Low RDS(on) 40 V MOSFETs from Nexperia deliver highest power density for Automotive and Industrial applications
Class-leading SOA and Avalanche characteristics increase ruggedness and reliability

New Trench Schottky rectifiers from Nexperia increase efficiency for fast switching applications
AEC-Q101 approved devices up to 100 V and 20 A combine low switching losses and increased safe operating area

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