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EMC Components: TDK develops industry’s first high-reliability chip beads for automotive
TDK Corporation announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ℃ environments.

TDK Corporation (TSE:6762) today announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ℃ environments. This series marks the industry’s first* high-reliability chip bead specifically designed for automotive applications associated with engine control modules (ECM), anti-lock brake systems (ABS), electric power steering (EPS), electric and hybrid electric vehicles (EV/EHV), inverters and LED headlights.

In high-temperature automotive environments, such as engine compartments, high-durability solder is increasingly used to prevent solder cracks in the bonds between chip components and the mounting substrate. Since high-durability solders do not stretch easily and impart higher stress compared with conventional solders, they place a large load on chip components and do not meet the reliability requirements of existing chip beads. With improvements to the terminal electrode material and plating process, the MMZ1608-HE series improves the bonding strength between the terminal electrode and plating, making it ideal for use with high-durability solder in 150 ℃ environments.

The four products in the series have a rated current max ranging from 200 to 300 at 150 ℃, DC resistance max between 0.15 to 0.5, and impedance from 120-1000, respectively.

TDK will continue to expand its lineup of compact sizes and various impedances to support a wide range of automotive specifications and designs.

* Source: TDK, as of September 2021

Main applications
  • Automotive electrical control chips on which high-durability solder is expected to be used, including ECM, ABS, EPS, EV-EHV, inverters and LED headlights
Main features and benefits
  • Compatible with high durability soldering in 150 ℃ environments
Key data
Type Impedance
[Ω] ± 25%
DC resistance
[Ω] max.
Rated current
[㎃] max.
@125℃
Rated current
[㎃] max.
@150℃
MMZ1608SHE121ATD25 120 0.15 500 300
MMZ1608SHE471ATD25 470 0.30 500 250
MMZ1608SHE601ATD25 600 0.35 500 200
MMZ1608SHE102ATD25 1000 0.50 400 200

Further information on the products can be found under - LINK -   .

2021092901 / 29.09.2021 / Electronic-components / TDK Corporation /

EMC Components: TDK develops industry’s first high-reliability chip beads for automotive
TDK Corporation announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ℃ environments.

Surge protection: Failsafe chip varistors for automotive battery lines
TDK Corporation presents a new range of Open Mode chip varistors for electronic automotive assemblies that are directly connected to the battery. The new chip varistors offer reliable protection against transient surge voltages according to ISO 7637-2, and meet the failsafe requirements according to the VW standard VW 80808. Even when subject to excessive bending stress, short-circuits are avoided, which is particularly important for unswitched battery terminals (e.g. terminal 30).

Inductors: Compact dual inductors with high saturation current
TDK Corporation has extended its range of dual inductors to include the new EPCOS series B82477D6*. The seven series types cover an inductance range from 2 x 3.9 µH to 2 x 47 µH and are designed for maximum rated currents from 2.83 A to 7.05 A. A special feature of the inductors, which are certified according to AEC-Q200 and compatible with RoHS, are the high saturation currents of up to 16.1 A.

Aluminum electrolytic capacitors: Compact design with high ripple current capability
TDK Corporation (TSE:6762) presents the new B43707* and B43727* series of EPCOS aluminum electrolytic capacitors with screw terminals. They are designed for rated voltages of between 400 V DC and 450 V DC and cover a capacitance range from 1800 µF to 18,000 µF.

TDK announces world’s first MIPI standard SoundWire® microphone
TDK Corporation (TSE: 6762) introduces the world’s first MIPI Standard SoundWire® microphone for mobile, IoT and other consumer devices. This multimode microphone pushes the boundaries of digital microphone acoustic performance while providing advanced feature sets with very low power.

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Address Book


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MACH SYSTEMS s.r.o.


Pico Technology


Lynred


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Crowd Supply


Digi-Key Electronics


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TDK Corporation


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