Address Book
 

Friedrich Lütze GmbH
 

Analog Devices
 

ASRock Industrial
 

NVIDIA
 

Yamaichi Electronics USA Inc.
 

PICMG
 

Laird Thermal Systems
 

HARTING
 

Jenoptik
 

A.P.O. - ELMOS v.o.s.
 

MACH SYSTEMS s.r.o.
 

Pico Technology
 

Lynred
 

Advantech
 

EBV

01.07.2022 0:07:13
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
IRE-Q12
 
120W eighth brick DC-DC converters for r

congatec announces changes in top management to further accelerate company growth
Dr. Dirk Haft is new CEO, Daniel Jürgens new CFO

Deggendorf, Germany, December 21, 2021 * * * congatec – a leading vendor of embedded and edge computing technology – is pleased to announce its new leadership team, with Dr. Dirk Haft taking over as the new CEO and Daniel Jürgens as the new CFO. Gerhard Edi, previously CTO, will assume the newly created position of CSO (Chief Strategy Officer). Konrad Garhammer, previously Worldwide Director of Engineering, will move to the position of CTO. The aim of the new top management team is to accelerate internationalization, make the supply chain even more reliable and efficient, and generate further growth in new markets such as functional safety and critical infrastructures, which require congatec to build up new competencies in both software and manufacturing. 

Dr. Haft brings a wealth of leadership experience to take congatec to a new level of growth in the embedded and edge computing markets. Jürgens adds international M&A and private equity experience to the updated congatec management team. Gerhard Edi, a congatec co-founder and a veteran of the embedded computing industry, will be responsible for the future technology and product strategy as CSO and also drive expansion of strategic partnerships with technology suppliers, partners and customers. 

The congatec advisory board warmly welcomes Dr. Dirk Haft, Daniel Jürgens and Konrad Garhammer to the management team and looks forward to working with them for the next stage of congatec’s growth trajectory, which aims to further strengthen the company’s position as a global market leader in embedded and edge computing. The accelerated growth strategy will make congatec an even stronger partner for customers, helping them even more effectively to solve their constantly changing technology and business challenges. 

Bringing more than 20 years of experience in leading technology companies, Dr. Haft is looking forward to his new position: “It is an honor to become the CEO of such an innovative high-tech company. congatec has a clear focus, direction and mission in a dynamic and growing market. My task now is to identify and coordinate internal and external growth opportunities, with the goal to continue elevating congatec’s status as a global player in embedded computer technologies. With Gerhard Edi as CSO, Konrad Garhammer as CTO, Daniel Jürgens as CFO and Thomas Schultze as COO, I am very fortunate to have such strong and experienced partners in the executive board who complement my skills and will support me in driving our growth strategies.” Dr. Haft comes to congatec from his roles as board member of Wittenstein SE and as CEO of attocube systems AG. He holds a PhD in Physics from LMU Munich (Ludwig-Maximilians-Universität München). 

Daniel Jürgens joins congatec from his previous position as CFO at VIA optronics AG, a fast-growing high-tech company listed at the New York stock exchange (NYSE:VIAO). On the basis of this experience, Jürgens also sees strong growth potential for congatec. “congatec is an iconic company in the embedded computing segment and already well positioned for growth,” states Jürgens, adding: “I’ll be bringing my M&A and private equity experience plus my own motivation to the table to accelerate the growth and success of congatec.” 

The new CTO Konrad Garhammer joined congatec in 2016 from what is now Saab Sensor Systems Germany (formerly Saab Medav Technologies). Under the leadership of Gerhard Edi, he expanded the global development team to over 100 employees in his role as Worldwide Director of Engineering, drove technological development, introduced agile workflows and led the team as Edi’s right hand. “I am very pleased to have been entrusted to take on full responsibility for this team and look forward to expanding our performance further,” explains Garhammer. 

Daniel Jürgens started in September 2021, Dr. Dirk Haft took up his new role on November 1. Gerhard Edi and Konrad Garhammer assumed their new positions on December 15. The outgoing CEO Jason Carlson and CFO Josef Wenzl will support the new management team as Senior Advisors to facilitate a smooth transition. The congatec advisory board wants to take the opportunity to thank Carlson and Wenzl for their efforts and leadership in helping to institutionalize congatec’s organization and processes, and in securing its global leadership position in embedded computing.

2021122701 / 27.12.2021 / Various / congatec AG /

congatec and S.I.E launch co-creation services for the digitization of healthcare
Value partnership for creating medical edge computing systems that meet patient, data, and cybersecurity requirements

congatec to enter the functional safety market
Functional safe computing platforms for mixed-critical applications

Modular 5G cells for real-time communications
Real-time capable 5G cells with integrated edge servers are a key enabling technology for digital transformation, opening a plethora of new opportunities for IIoT, Industry 4.0 and critical infrastructure applications.

congatec simplifies Arm deployments with i.MX 8M Plus
Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified

TSN synchronized real-time over 5G
congatec introduces Computer-on-Modules for collaborative 5G robots and material handling systems at Smart Factory & Automation World

congatec introduces vehicle computing technology for smart mobility at Intertraffic Amsterdam
Embedded computing engines that put smart vehicle developers into the fast lane

congatec and S.I.E join in strategic partnership
Focus on OEM platforms for regulated industries

World premiere for x86 based COM-HPC Server
congatec introduces three new Server-on-Module families with Intel Xeon D processors

Webinar | Realtime and AI integration with COM-HPC
This COM-HPC webinar puts engineers in the fast lane to leveraging the latest technology for hosting powerful AI applications together with mission critical real-time tasks on one single platform. Realtime and AI integration with COM-HPC Webinar with Speakers from Real-time-systems, Intel and congatec.

COM-HPC Carrier Design Guide compliant ecosystem
congatec welcomes the publication of the COM-HPC Carrier Board Design Guide by the PCI Industrial Computer Manufacturers Group (PICMG) with the launch of a fully specification compliant ecosystem for engineers of COM-HPC Client and Server module based designs.

Intel Alder Lake Product Video
Check out the new congatec Alder Lake video showing you performance gains and improvements to accelerate the world of embedded and real-time edge computing systems.

A quantum leap in core count
congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors

Company of the week

Friedrich Lütze GmbH

Interesting video


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


Address Book


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


INTEL


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU



Calendary
electronica 2022, 15.11.-18.11.2022, München, DE
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813