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Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks
Rugged and reliable devices are AEC-Q101 compliant and save board space

Nexperia, the expert in essential semiconductors, today announced its latest product additions to a growing range of discrete devices which it provides in leadless DFN packages with side-wettable flanks (SWF). These space-saving and rugged components help satisfy the needs of next generation applications in smart and electric vehicles. The AEC-Q101 range of devices available cuts across all Nexperia’s product groups and includes:

  • BC817QBH-Q and BC807QBH-Q series 45 V, 500 mA NPN/PNP general-purpose transistors in DFN1110D-3.
  • BAT32LS-Q and BAT42LS-Q general purpose Schottky diode in DFN1006BD-2
  • BAS21LS-Q high-speed switching diode in DFN1006BD-2 package.
  • PDTA143/114/124/144EQB-Q series 50 V 100 mA PNP Resistor-Equipped Transistor (RET) family in DFN1110D-3 package.
  • 2N7002KQB – 60 V N-channel Trench MOSFET and BSS84AKQB – 50 V, P-channel Trench MOSFET in DFN1110D-3 package.

Leadless DFN packages are up to 90% smaller than SOT23 packages and this helps to reduce the amount of board space required for the rapidly increasing number of electronic components being used in the latest vehicles. The side-wettable flank feature offers very reliable automated optical inspection (AOI) of solder joint quality. Nexperia’s DFN packages deliver excellent thermal performance with high Ptot and are also the most rugged in the industry passing extended lifetime and reliability tests.

"Nexperia pioneered side-wettable DFN and now offers the widest range of AEC-Q101 qualified discrete components in these miniature leadless packages”, states Mark Roeloffzen, Senior Vice President & General Manager of Nexperia’s Bipolar Discretes Business Group. “More than 460 different high-volume devices are available in the recently released DFN1412D-3, DFN1110D-3, and DFN1006BD-2 packages. By offering even more devices in these miniature packages, Nexperia provides design engineers with greater opportunities to make their designs future-proof, having an impact on the mobility of the future. The new technology has already seen success with design-in and commitment from major Tier 1 automotive suppliers”.

Samples and production quantities are available today. For more information, including product specs and datasheets, please visit www.nexperia.com/automotiveDFN

2022052202 / 21.05.2022 / Electronic-components / NEXPERIA /

Nexperia launches new portfolio of application specific MOSFETs (ASFETs) for automotive airbags
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.

Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks
Rugged and reliable devices are AEC-Q101 compliant and save board space

Nexperia’s 50 µA Zener diodes portfolio extends battery-time and saves PCB space
The comprehensive product range covers every application from 1.8 V to 75 V

Nexperia introduces a range of A-selection Zener diodes for precise voltage reference with the industry’s lowest tolerance of ±1%
The comprehensive product range covers every application from 2.4 V to 75 V

Nexperia expands its wide bandgap semiconductor offering with new family of high-performance Silicon Carbide (SiC) Diodes
Samples of industrial-grade 650 V, 10 A SiC Schottky diode now available. Parts with 1200 V / 6-20 A current range and automotive-grade parts also planned

Nexperia delivers extremely low clamping bidirectional ESD protection devices for USB4 standard interfaces
TrEOS diodes offer industry-leading insertion loss and return loss characteristics for more robust USB4TM data transmission

Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit

Nexperia launches ‘Power Live’ September 21-23 2021
Participate in live discussions on GaN, MOSFETs, power diodes and bipolar transistors for automotive and industrial applications; View on-demand video demos direct from Nexperia’s labs

Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch

Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost

World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins
New packages enable large logic functions to be included in small form factor systems

Nexperia’s new bipolar junction transistors in DPAK-package deliver high reliability performance for automotive and industrial applications
MJD series now available covering 2 – 8 A and 45 – 100 V and strengthening Nexperia’s power portfolio

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Friedrich Lütze GmbH

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Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


Address Book


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.


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Calendary
electronica 2022, 15.11.-18.11.2022, München, DE
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

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