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Toshiba announces availability of highly accurate SPICE models
G2 SPICE models offer more accurate transient modelling for power applications

Toshiba Electronics Europe GmbH (“Toshiba”) announces the availability of highly accurate G2 SPICE models allowing designers to more faithfully simulate the performance of their designs before committing to hardware. Alongside Toshiba’s existing G0 SPICE models that emphasize computational speed over accuracy, the new range of G2 SPICE models is now accessible to simulate transient characteristics more accurately.

Simulation is a valuable tool for designers as they reduce the number of prototypes required, saving the need for respins, thereby increasing development efficiency, and reducing overall time, cost, and risk.

In the challenging world of power electronics and automotive design there is a strong demand for preliminary performance predictions of the EMI performance and power dissipation of the entire system. This leads to a growing demand for SPICE models for power semiconductors that can predict power conversion efficiencies, EMI and other relevant parameters.

These new G2 SPICE models for discrete power devices are created using the macro model format, combining multiple compact models to match the structure of the device, representing the electrical characteristics with a few non-linear elements and a continuous arbitrary function. With this approach, switching simulations are more accurate and closer to actual measurements by improving the reproducibility of the high-current-domain characteristics of the ID-VDS curve, including the voltage-dependent characteristics of the parasitic capacitance.

Available from Toshiba’s website, the G2 models cover low voltage MOSFETs (12V-300V) and medium to high voltage MOSFETs (400V to 900V). Versions are available for PSpice and LTSpice.

2022062801 / 28.06.2022 / Electronic-components / Toshiba Corporation /

Toshiba sample software package expands microcontroller development tools ecosystem
Sample software for M4K MCUs now works out of the box with SEGGER Embedded Studio as well as Arm® Keil® MDK and IAR Embedded Workbench® for Arm

Toshiba announces availability of highly accurate SPICE models
G2 SPICE models offer more accurate transient modelling for power applications

Toshiba Releases High Voltage 1500V Automotive Photorelay
New device is suited for high voltage automotive batteries

Compact Low On-Resistance MOSFET Devices from Toshiba Significantly Enhance Battery Pack Operation
Targeted at use in the Li-Ion battery packs of portable consumer hardware

Toshiba’s New Photorelays with Low Trigger Current Contribute to Low Power Consumption in Battery-Powered Equipment
Maximum trigger LED current of 1mA and increased sensitivity of the photodiode array

Toshiba Delivers Mobile Hydrogen Fuel Cell System to Fuel Cell Ship
Toshiba Energy Systems & Solutions Corporation (hereinafter “Toshiba ESS”) announced that the company has delivered a mobile 30kW hydrogen fuel cell system, which volume per unit power output is reduced to 1/3 compared to the stationary fuel cell systems, to a fuel cell ship.

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