Address Book
 

Friedrich Lütze GmbH
 

Analog Devices
 

ASRock Industrial
 

NVIDIA
 

Yamaichi Electronics USA Inc.
 

PICMG
 

Laird Thermal Systems
 

HARTING
 

Jenoptik
 

A.P.O. - ELMOS v.o.s.
 

MACH SYSTEMS s.r.o.
 

Pico Technology
 

Lynred
 

Advantech
 

EBV

14.08.2022 5:03:38
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
IRE-Q12
 
120W eighth brick DC-DC converters for r

congatec extends its 12th Gen Intel Core processor based COM-HPC and COM Express Computer-on-Module portfolio with seven more power-efficient new processor variants
Highly powerful, yet passively cooled

congatec – a leading vendor of embedded and edge computing technology – introduces seven less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake) on 7 new COM-HPC and COM Express Computer-on-Modules each. Featuring the new Intel hybrid architecture with its mix of performance cores (P-cores) and efficient cores (E‑cores), the BGA-solderable processor variants consume just 15 to 28 W base power, which enables engineers to utilize them in fully passively cooled embedded and edge computing platforms. This eliminates the need for costly cooling options and improves the ruggedness and MTBF of system designs. 

The lower energy consumption is mainly achieved by reducing the number of P-cores while maintaining the E-core count. For example, in the Intel Core i7 processor performance range heterogenous workloads benefit from 8 efficient cores in all available variants and can scale down from 6 P-cores (12800HE/45 W base power) to either 4 (1270PE/28 W base power) or 2 P-cores (1265UE/ 15 W base power). Another power saving factor is less PCIe lanes (20 instead of 28). As selected processors are also suitable for hard real-time applications, support virtual machines and include Intel TCC and TSN support, these new congatec Computer-on-Modules are perfect candidates to consolidate a multitude of different heterogenous workloads including AI and/or immersive GUIs on one single passively cooled edge computing platform. 

Target industrial markets for the new high-performance Computer-on-Modules with Intel Core i7/5/3 and Celeron processors can be found wherever passively cooled computing systems need more performance. This includes, for example, edge computers and IoT gateways incorporating multiple virtual machines for smart factories and process automation, AI based quality inspection and industrial vision, real-time collaborative robotics, and autonomous logistics vehicles for warehousing and shipping. Typical outdoor applications include autonomous vehicles and mobile machines, video security and gateway applications in transportation and smart cities, as well as 5G cloudlets and edge devices requiring AI supported packet inspection. 

Offering DDR5 memory support in all different core combination variants, the new congatec Computer-on-Modules with PCIe Gen 4 supporting Intel hybrid architecture accelerate multithreaded applications and make background task execution more efficient. Also impressive is the graphics performance of the integrated Intel Iris Xe GPU with up to 96 execution units. 

Besides highest bandwidth and overall improved performance, the new flagship COM‑HPC Client and COM Express Type 6 modules impress with dedicated AI engines supporting Windows ML, Intel OpenVINO toolkit and Chrome Cross ML. The different AI workloads can be seamlessly delegated to the P-cores, E-cores and the GPU execution units to process even the most compute-intensive edge AI tasks. The built-in Intel Deep Learning boost technology leverages different cores via Vector Neural Network Instructions (VNNI), and the integrated graphics supports AI accelerated DP4a GPU instructions that can even be scaled to dedicated GPUs. Furthermore, Intel’s lowest power built-in AI accelerator, the Intel Gaussian & Neural Accelerator 3.0 (Intel GNA 3.0), enables dynamic noise suppression and speech recognition and can even run while the processor is in low power states for wake-up voice commands. 

Combining these features with support for Real-Time Systems’ hypervisor technology as well as OS support for Real-Time Linux and Wind River VxWorks, makes these modules a truly rounded ecosystem package to facilitate and accelerate the development of edge computing applications. 

The feature set in detail

The new conga-HPC/cALP COM-HPC Client Size A modules (95x120mm), as well as the conga-TC670 COM Express Compact Type 6 modules (95x95mm) are available with 6 energy efficient 12th Gen Intel Core processors as well as a cost optimized Celeron processor. Both module families support up to 64 GB ultra-fast DDR5 SO-DIMM memory with 4,800 MT/s. Extraordinary graphics support for up to 4 independent displays and up to 8k resolution is provided by the integrated Intel Iris Xe  graphics with the Intel Core i7 and i5 processors, and by the Intel UHD graphics with Intel Core i3 and Intel Celeron. To connect peripherals with massive bandwidth, the COM-HPC modules support up to 16 PCIe Gen 4 and 8 PCIe Gen 3 lanes, and additionally boast up to 2x Thunderbolt. The COM Express variants feature up to 8 PCIe Gen 4 and 8 PCIe Gen 3 lanes. Both support an optional and ultra-fast NVMe SSD. Further storage media can be connected via 2x SATA Gen 3. For networking, the COM-HPC module offers 2x 2.5 GbE, whereas the COM Express module executes 1x 2.5 GbE, with both supporting TSN. Sound is provided via SoundWire, HDO or I2S in the COM-HPC version, and HDA on the COM Express modules. Comprehensive board support packages are provided for all leading Real-Time Operating Systems, including hypervisor support from Real-Time Systems as well as Linux, Windows and Android. 

The entire range of 12th Gen Intel Core processor based conga-TC670 COM Express Type 6 Compact modules (95x95mm) and the conga-HPC/cALP COM-HPC Client Size A modules (95x120mm) comprises the following 10 different configurations:

Processor Cores/ (P + E) P-cores
Freq. [GHz] 
E-cores
Freq. [GHz]    
Threads GPU Compute Units CPU Base Power [W]
Intel Core i7 12800HE 14 (6+8) 2.4 / 4.6 1.8 / 3.5 20 96 45
Intel Core i7 1270PE (new) 12 (4+8) 1.8 / 4.5 1.2 / 3.3 16 96 28
Intel Core i7 1265UE (new) 10 (2+8) 1.7 / 4.7 1.2 / 3.5 12 96 15
Intel Core i5 12600HE 12 (4+8) 2.5 / 4.5 1.8 / 3.3 16 80 45
Intel Core i5 1250PE (new) 12 (4+8) 1.7 / 4.4 1.2 / 3.2 16 80 28
Intel Core i5 1245UE (new) 10 (2+8) 1.5 / 4.4 1.1 / 3.3 12 80 15
Intel Core i3 12300HE 8 (4+4) 1.9 / 4.3 1.5 / 3.3 12 48 45
Intel Core i3 1220PE (new) 8 (4+4) 1.5 / 4.2 1.1 / 3.1 12 48 28
Intel Core i3 1215UE (new) 6 (2+4) 1.2 / 4.4 0.9 / 3.3 8 64 15
Intel Celeron 7305E (new) 5 (1+4) 1.0 / N/A 0.9 / 0.9 5 48 15

Further information on the new conga-HPC/cALP COM-HPC Client Size A modules can be found at: https://www.congatec.com/en/products/com-hpc/conga-hpccalp/

To find out more about the conga-TC670 COM Express Type 6 Compact modules, please visit https://www.congatec.com/en/products/com-express-type-6/conga-tc670/ 
 

2022062805 / 02.07.2022 / Various / congatec AG /

congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs

congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change

congatec modules drive Intel Labs China’s Robot 4.0 platform for research and education
Making the robotic edge modular

congatec launches five new COM-HPC Server Size D modules with Intel Xeon D-2700 processors following the “less is more” approach
An advance into the world of mixed-critical real-time servers

congatec extends its 12th Gen Intel Core processor based COM-HPC and COM Express Computer-on-Module portfolio with seven more power-efficient new processor variants
Highly powerful, yet passively cooled

congatec and S.I.E launch co-creation services for the digitization of healthcare
Value partnership for creating medical edge computing systems that meet patient, data, and cybersecurity requirements

congatec to enter the functional safety market
Functional safe computing platforms for mixed-critical applications

Modular 5G cells for real-time communications
Real-time capable 5G cells with integrated edge servers are a key enabling technology for digital transformation, opening a plethora of new opportunities for IIoT, Industry 4.0 and critical infrastructure applications.

congatec simplifies Arm deployments with i.MX 8M Plus
Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified

TSN synchronized real-time over 5G
congatec introduces Computer-on-Modules for collaborative 5G robots and material handling systems at Smart Factory & Automation World

congatec introduces vehicle computing technology for smart mobility at Intertraffic Amsterdam
Embedded computing engines that put smart vehicle developers into the fast lane

congatec and S.I.E join in strategic partnership
Focus on OEM platforms for regulated industries

Company of the week

Friedrich Lütze GmbH

Interesting video


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


Address Book


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


INTEL


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU



Calendary
International Engineering Fair, 4.-7.10. 2022, Brno, CZ
electronica 2022, 15.11.-18.11.2022, München, DE
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813