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Infineon and Oxford Ionics join forces to develop leading Trapped Ion Quantum Processors
Infineon Technologies AG and Oxford Ionics announce a collaboration to build high-performance and fully integrated quantum processing units (QPUs).

The combination of Oxford Ionics’ unique electronic qubit control (EQC) technology with Infineon’s world-leading engineering and manufacturing capabilities, as well as expertise in quantum technology, will lay the foundations for the industrial production of QPUs offering hundreds of qubits within the next five years.The goal is to move quantum computing technology out of the research lab into real industrial solutions.

Quantum computing opens up the next frontier in computing power for many industries seeking radical improvement in their processes and capabilities. Getting there requires developing qubit technologies that can be built at a massive scale while controlling a growing number of qubits and maintaining quantum error levels at and below the current state-of-the-art. Oxford Ionics’ EQC technology offers a path to integrating trapped ion qubits – the leading qubit technology by quantum error levels – into Infineon’s mature semiconductor processes.

 “The great challenge in quantum computing is scaling whilst improving performance”, said Chris Ballance, Co-Founder of Oxford Ionics. “There are technologies that can be fabricated at scale but don't perform, and there are technologies that perform but don't scale. Our electronic control is uniquely placed to do both. Working with Infineon and its mature and flexible semiconductor process, allows us to speed up the accessibility of a commercial QPU. Due to our market-leading error rates, these processors need dramatically fewer qubits to solve useful problems than other technologies.”

The first Oxford Ionics devices will be cloud accessible by the end of 2022, offering commercial players access to these cutting-edge Quantum Computers. Fully integrated devices with high enough performance to scale to hundreds of qubits are planned to be available in less than two years. The ultimate goal of Infineon and Oxford Ionics is to offer, within five years, individual, fully integrated QPUs offering hundreds of qubits networked together into a quantum supercomputing cluster using Oxford Ionics’s quantum networking technology.

 “The role of Infineon is to take the ground-breaking work of Oxford Ionics to scale properly towards meaningful qubit counts and low error rates. Infineon’s ion traps can enable that in conjunction with our predictable, repeatable, and reliable manufacturing and assembly capabilities,” said Stephan Schaecher, Director of New Application, Innovation, and Quantum Computing at Infineon Technologies Industrial Division.

About Infineon’s ion trap modules

Infineon’s ion traps accelerate the development of powerful quantum computers to solve optimization problems that their classical counterparts could not address. This research already started in 2016 at Infineon fab site in Villach to combine scientific findings with industrial-scale quantum technologies. Knowing how to industrialize and combine novel materials and technologies, Infineon offers an advanced technology platform for customized traps that are predictable, repeatable, and reliable. Based on this platform, Infineon paves the way towards thousands of qubits by working with partners on cryogenic control electronics and optics integration. This will allow scientists and companies to focus on their core tasks, push the boundaries of science and research, and create successful and winning quantum computing systems that will enable industry and academia to solve meaningful problems.

Infineon is pursuing various approaches towards quantum computing. Next to iontrap the company is also active in superconducting and semiconductor-based qubits. As a co-founder of the Quantum Technology and Application Consortium (QUTAC) Infineon drives the topic from technology to usable application. 

More information is available at www.infineon.com/trappedions and at http://www.infineon.com/quantumcomputing.

About Oxford Ionics

Oxford Ionics is the high-performance quantum computing company, delivering world-leading innovations to create the most powerful, accurate and reliable quantum computers to solve the world's most important problems. Unparelled precision is realised by combining the world's highest quality qubits – trapped ions – with a unique noiseless electronic qubit control technology. Oxford Ionics achieves the highest performance ever demonstrated while using chips manufactured on a semiconductor production line.

For more information visit www.oxionics.com or contact media@oxionics.com

2022070603 / 07.07.2022 / Electronic-components / Infineon Technologies AG /

Infineon’s CoolSiC™ devices support bi-directional inverter from Delta to let electric vehicles become emergency backup power

Infineon and Oxford Ionics join forces to develop leading Trapped Ion Quantum Processors
Infineon Technologies AG and Oxford Ionics announce a collaboration to build high-performance and fully integrated quantum processing units (QPUs).

Optimized CoolSiC™ MOSFETs 650 V in D²PAK for lowest losses in the application and highest reliability in operation

World’s first TPM 2.0 with open-source software stack cuts down security integration efforts in industrial, automotive and IoT applications
Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption and user authentication. Hence, they are crucial for connected industrial, automotive and other embedded devices.

1200 V level-shift three-phase SOI EiceDRIVER™ offers superior robustness
Infineon Technologies AG broadens its level-shift EiceDRIVER™ portfolio with a 1200 V three-phase gate driver. It is based on the company’s unique silicon-on-insulator (SOI) technology. The device provides leading negative VS transient immunity, superior latch-up immunity, fast over-current protection, and the monolithic integration of real bootstrap diodes. These unique features reduce BOM and enable a more robust design with a compact form factor suitable for industrial drives and embedded inverter applications.

Infineon adds 40 V device in PQFN to its OptiMOS™ Source-Down power MOSFET family
Contemporary power system designs demand high power density levels and small form factors to maximize system-level performance. Infineon Technologies AG tackles this challenge by focusing on system innovation with enhancements on the component level. Adding to the 25 V device introduced in February, Infineon now brings the OptiMOS™ 40 V low-voltage power MOSFET to the market.

QPL-qualified SupIR-SMD package for rad hard MOSFETs enables higher performing space power systems
Reliably attaching surface mount hermetic power packages to PCBs is a common challenge faced by space system designers.

CoolSiC™ MOSFET 1700 V SMD enables best efficiency and reduced complexity for high voltage auxiliary power supplies
Infineon Technologies AG complements its CoolSiC™ MOSFET offering with yet another voltage class. Having added 650 V to the portfolio earlier this year, the company is now launching the 1700 V class with its proprietary trench semiconductor technology.

Secured connectivity and blockchain technology for data-driven supply chains
Industrial supply chain solutions like digital twins, usage-based pricing models, product warranties or licensing solutions increasingly require reliable and auditable sensor and process data. Yet security is paramount, especially when data is transferred from one company or organization to another.

Safety in cars: Infineon’s AURIX™ is the first embedded safety controller worldwide to be ASIL-D certified according to ISO 26262:2018

CES 2020: Infineon presents the world’s smallest 3D image sensor for face authentication and photo effects on smartphones and the like
Munich/Las Vegas, Germany/USA, 6 January 2020 – Reliable face authentication, improved photo functions and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data.

3D image sensor: Infineon enables easy smartphone unlock by face recognition
One megatrend feature in mobile communications is to unlock smartphones by 3D face recognition instead of fingerprint or PIN. Making authentication more convenient and more secure, it may soon become indispensable for mobile payment applications and mobile ID. With the 3D image sensor chip from Infineon Technologies AG the unlock-with-your-face feature becomes smarter, faster and more reliable.

Company of the week

Friedrich Lütze GmbH

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Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


Address Book


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


INTEL


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU



Calendary
International Engineering Fair, 4.-7.10. 2022, Brno, CZ
electronica 2022, 15.11.-18.11.2022, München, DE
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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