Address Book
 

Friedrich Lütze GmbH
 

Analog Devices
 

ASRock Industrial
 

NVIDIA
 

Yamaichi Electronics USA Inc.
 

PICMG
 

Laird Thermal Systems
 

HARTING
 

Jenoptik
 

A.P.O. - ELMOS v.o.s.
 

MACH SYSTEMS s.r.o.
 

Pico Technology
 

Lynred
 

Advantech
 

EBV

14.08.2022 5:03:38
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
IRE-Q12
 
120W eighth brick DC-DC converters for r

congatec modules drive Intel Labs China’s Robot 4.0 platform for research and education
Making the robotic edge modular

Deggendorf, Germany, 12 July 2022 * * * congatec – a leading vendor of embedded and edge computing technology – announced today that Intel Labs China has chosen congatec COM Express modules for easy and efficient design-in and flexible processor scalability in its Heterogeneous Extensible Robot Open (HERO) platform. Created by the Autonomous System Lab of Intel Labs China to simplify and accelerate the development of next-generation IoT connected service robots, retail robots, and self-driving vehicles, the Robot 4.0 platform integrates artificial intelligence (AI) for research, education, and experimental purposes. The open platform combines Intel’s heterogeneous processor technology with Intel’s OpenVINO AI toolkit and offers a comprehensive suite of software libraries for localization, navigation, planning, and human-robot interaction. In this environment, the congatec COM Express modules are now providing the demanded performance scalability from low-power Intel Atom to high end Intel Xeon processors. The standard configuration utilizes conga-TC370 Computer-on-Modules with 8th Generation Intel Core SoC processors.
 

The global robotics market reached 23.7 billion USD in 2020 and is expected to grow to 74 billion USD by 2026 with an average growth rate of about 20 % [1]. For the market to continue this strong growth, robots need greater flexibility and autonomy, as well as fast configurability to expand the range of tasks and applications. This requires massive computing power with the lowest possible latency, which makes real-time edge computing a key technology.
 

"HERO is a compact and heterogeneous low-power, high-performance system platform solution that the Intel Labs China built specifically for the development of intelligent robots – such as service robots, medical robots, self-driving cars, etc.," says Dr. Song Jijiang, VP, Director of Intel Labs China "After three years of continuous development, and thanks to the heterogeneous and open approach, HERO is now a perfect development platform for a wide range of Robotics 4.0 projects. Going forward, the Intel Labs China will continue its focus on the four main areas of artificial intelligence, intelligent transportation, wireless data communication and service robotics, collaborating with industry, universities and research partners to fully leverage the value of data and jointly drive the digital transformation of industry."

 

“We are excited to be an elementary part of Intel Labs China’s HERO ecosystem. Robotics 4.0 is a truly progressive and forward-looking technology area, especially in combination with AI and the OpenVINO toolkit that facilitate the optimization of a deep learning model on Intel’s heterogeneous computing hardware,” says Becky Lin, Country Manager China at congatec. “This is where the congatec COM Express modules really demonstrate their potential since flexible edge computing platforms are a paradigm of Robotics 4.0.”

 

Requirements for Robotics 4.0

Besides the computing hardware, Intel Labs China equipped its HERO education kits with the Advanced AI Practice Suite including libraries for basic perception, interaction, navigation, planning, and manipulation. An optional Senior AI Development Suite adds adaptive interaction and continuous learning, including 3D semantic scene understanding. The HERO platform can also be extended further as needed. For example, the heterogeneous computing platform can incorporate an Intel Arria 10 GX FPGA or other third party hardware acceleration modules. The adaptive learning part can be expanded with additional perception modules to enhance existing or add new perception functions. This way, robots can quickly and flexibly be adapted to the different requirements of their future missions. Additionally, the modular hardware also enables application-specific load and performance balancing.

 

Proof of the HERO concept

The versatile congatec COM Express modules allow the creation of reliable and optimized robotic systems for a multitude of applications while simplifying system integration. This independent, scalable and future-proof modular platform gives HERO designers more time to focus on the development of innovative robotic systems.

For more information please visit: https://www.congatec.com/en/technologies/making-the-robotic-edge-modular/


[1] https://www.mordorintelligence.com/industry-reports/robotics-market

2022072001 / 20.07.2022 / Industry automation / congatec AG /

congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs

congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change

congatec modules drive Intel Labs China’s Robot 4.0 platform for research and education
Making the robotic edge modular

congatec launches five new COM-HPC Server Size D modules with Intel Xeon D-2700 processors following the “less is more” approach
An advance into the world of mixed-critical real-time servers

congatec extends its 12th Gen Intel Core processor based COM-HPC and COM Express Computer-on-Module portfolio with seven more power-efficient new processor variants
Highly powerful, yet passively cooled

congatec and S.I.E launch co-creation services for the digitization of healthcare
Value partnership for creating medical edge computing systems that meet patient, data, and cybersecurity requirements

congatec to enter the functional safety market
Functional safe computing platforms for mixed-critical applications

Modular 5G cells for real-time communications
Real-time capable 5G cells with integrated edge servers are a key enabling technology for digital transformation, opening a plethora of new opportunities for IIoT, Industry 4.0 and critical infrastructure applications.

congatec simplifies Arm deployments with i.MX 8M Plus
Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified

TSN synchronized real-time over 5G
congatec introduces Computer-on-Modules for collaborative 5G robots and material handling systems at Smart Factory & Automation World

congatec introduces vehicle computing technology for smart mobility at Intertraffic Amsterdam
Embedded computing engines that put smart vehicle developers into the fast lane

congatec and S.I.E join in strategic partnership
Focus on OEM platforms for regulated industries

Company of the week

Friedrich Lütze GmbH

Interesting video


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


Address Book


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


INTEL


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU



Calendary
International Engineering Fair, 4.-7.10. 2022, Brno, CZ
electronica 2022, 15.11.-18.11.2022, München, DE
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813