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MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
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TH381
 
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TP-1303
 
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TDK announces world’s first MIPI standar
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Samsung Releases Portable SSD T7 Touch –

congatec welcomes COM Express 3.1 specification with compliant Computer-on-Modules
Performance boost now standard-compliant

congatec – a leading vendor of embedded and edge computing technology – welcomes the ratification of the COM Express 3.1 standard with the launch of 10 compliant Computer-on-Modules based on 12th Gen Intel Core processors (formerly codenamed Alder Lake). The modules will be equipped with the new updated 16 Gbps COM Express connector and support high-speed interfaces such as PCIe 4.0 and USB 3.2. As upgrades of the already existing family of COM Express Type 6 modules, the new 3.1 compliant modules offer up to 14 cores/20 threads. With these new modules, customers can now give their designs a performance boost that is compliant to this officially ratified specification. This delivers maximum design security and safeguards reliable high-performance roadmaps for existing COM Express designs long into the future.
 

“The launch of the COM Express 3.1 specification is a huge step in future-proofing this established standard that has been on the market for nearly 18-years. All existing high-performance embedded designs based on COM Express Computer-on-Modules can now receive further performance upgrades in compliance with the standard. Accomplishing this has been one of the most important recent tasks of the PICMG organization, as customers need to sustainably secure their existing investments in COM Express compliant carrier board designs in these challenging times,” explains Christian Eder, Director Product Marketing at congatec.
 

Besides the support of PCIe 4.0 the new 3.1 COM Express specification allows further advanced features that were not previously supported, such as USB 4, MIPI-CSI connectors, signal integrity and loss budget information for SATA Gen 3 and SoundWire support. Despite all these improvements COM Express 3.1 Type 6 modules are fully backward compatible with 3.0 modules and carrier boards, ensuring that even older designs can get equipped with latest processor technologies.


For more information on the new COM Express 3.1 compliant conga-TC670 Computer-on-Modules, please visit https://www.congatec.com/en/products/com-express-type-6/conga-tc670/

The COM Express 3.1 specification can be purchased at https://www.picmg.org/product/com-express-module-base-specification-rev-3-1/

2022113001 / 30.11.2022 / Embedded / congatec AG /

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

congatec expands its portfolio of COM-HPC Computer-on-Modules with 13th Gen Intel Core processor to include high-end variants with LGA socket
The ultimate performance boost consolidated edge applications have been waiting for

congatec introduces new Computer-on-Modules with 13th Gen Intel Core processors
Happy new year for high-end embedded computers: The world’s fastest Client Computer-on-Modules generation is here

PICMG COM-HPC committee approves COM-HPC Mini pinout
Mini form factor for maximum performance

congatec welcomes COM Express 3.1 specification with compliant Computer-on-Modules
Performance boost now standard-compliant

Accelerating the real-time digitization
congatec introduces its ecosystem for TSN networked real-time factories and critical infrastructures

congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs

congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change

Company of the week

AERS

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Video Report from AMPER 2022


"Electronics is Magic" Adam Kuczyński Talks About Innovations - TME on Electronica 2022 [INTERVIEW]


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


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Yamaichi Electronics USA Inc.


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SECO S.p.A.


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Digi-Key Electronics


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Calendary
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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