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congatec introduces new Computer-on-Modules with 13th Gen Intel Core processors
Happy new year for high-end embedded computers: The world’s fastest Client Computer-on-Modules generation is here

Deggendorf, Germany, 3 January 2023 * * * congatec – a leading vendor of embedded and edge computing technology – announces the availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA assembly. congatec expects series production of OEM designs based on these new modules to ramp up quickly and massively as the new processors with long life availability offer vast improvements in many features yet are fully hardware compatible to the predecessors, which makes implementation very fast and easy. With Thunderbolt and enhanced PCIe support up to Gen5, the modules based on the new COM-HPC standard open up new horizons for developers in terms of data throughput, I/O bandwidth and performance density. The COM Express 3.1 compliant modules primarily help to secure investments in existing OEM designs, which includes upgrade options for more data throughput thanks to PCIe Gen4 support.
 

The new COM-HPC and COM Express Computer-on-Modules provide up to 8% single thread and up to 5% multithread[1] performance gains from the soldered 13th Gen Intel Core processors compared to 12th Gen Intel Core processors. The performance gains go hand in hand with a distinctly higher power efficiency due to an enhanced manufacturing process. Also new in this performance class (15-45 W Base Power) are DDR5 memory support and PCIe Gen5 connectivity on selected SKUs. Both contribute to even better multithread performance and data throughput. With up to 80 EU and ultra-fast encode and decode capabilities, the integrated Intel Iris Xe graphics architecture is ideally suited for enhanced graphics demands such as those found in video streaming and video data based situational awareness applications. All these features effect significant improvements in a wide range of industrial, medical, artificial intelligence (AI) and machine learning (ML) applications, as well as all types of embedded and edge computing with workload consolidation.

“The numerous improvements of the 13th Gen Intel Core processors help to make these new generations of Computer-on-Modules really outstanding. They give industry the opportunity to instantly upgrade already existing high-end embedded and edge computing solutions, which is what makes this new launch so extraordinarily significant for all our OEM customers and Value Adding Reseller partners,” explains Jürgen Jungbauer, Senior Product Line Manager at congatec.

The new conga-HPC/cRLP Computer-on-Module in COM-HPC Size A form factor and the compact conga-TC675 module based on the new COM Express 3.1 specification will become available in the below variants:

Processor Cores/ (P + E) Max. Turbo Freq. [GHz] P-cores / E-cores  Base Freq. [GHz] P-cores / E-cores Threads GPU Execution Units CPU Base Power [W]
Intel Core i5-1340PE 12 (4+8) 4.5 /3.3 1.8 / 1.3 16 80 28
Intel Core i5-1335UE 10 (2+8) 4.5 / 3.3 1.3 / 1.1 12 80 15
Intel Core i3-13300HE  8 (4+4) 4.6 / 3.4 2.1 / 1.5 12 48 45
Intel Core i3-1320PE 8 (4+4) 4.5 / 3.3 1.7 / 1.2 12 48 28
Intel Core i3-1315UE  6 (2+4) 4.5 / 3.3 1.2 / 0.9 8 64 15
Intel Pentium U300E 5 (1+4) 4.3 / 3.2 1.1 / 0.9 6 48 15


Application engineers can deploy the new COM-HPC Computer-on-Modules on congatec’s Micro-ATX Application Carrier Board conga-HPC/uATX for COM-HPC Client type modules to instantly capitalize on all the benefits and improvements of these new modules in combination with ultra-fast PCIe Gen5 connectivity.

For more information on the new Computer-on-Modules in COM-HPC Size A and COM Express 3.1 form factors, their tailored cooling solutions, and congatec’s migration services, please visit congatec’s landing page for 13th Gen Intel Core processor based embedded and edge computing solutions:
https://www.congatec.com/en/technologies/13th-gen-intel-core-computer-on-modules/

The datasheet of the new conga-HPC/cRLP Computer-on-Module in COM-HPC Size A is ready for download at
https://www.congatec.com/en/products/com-hpc/conga-hpccrlp/

The datasheet of the new conga-TC675 Computer-on-Module in COM Express Compact Type 6 can be found at
https://www.congatec.com/en/products/com-express-type-6/conga-tc675/


[1] Estimated results comparing Intel Core i7-13800HE to previous-generation Intel Core i7-12800HE processor are based on SPECrate2017_int_base (1-copy and n-copy) using InteI Compiler version 2021.2. Intel Configurations:

Performance results are based on Intel estimates as of November 2022.
Processor: Intel Core i7-13800HE PL1=45W, (6C+8c) 14C20T Turbo up to5.2 GHz; Intel Iris Xe graphics architecture with up to 96 EUs, DDR5-5200 2x32GB memory; Samsung* PM9A1(CPU attached) OS: Windows* 11

Performance results are based on Intel measurements as of November 2022.
Processor: Intel Core i7-12800HE PL1=45W, (6C+8c) 14C20T Turbo up to 4.6 GHz, Intel Iris Xe graphics architecture with up to 96 EUs, DDR5-4800 32GB memory, Samsung SSD 970 EVO Plus 1TB; Platform/ motherboard: Intel Corporation AlderLake-P DDR5 RVP, Windows 10 Enterprise LTSC 21H2 Bios: ADLPFWI1.R00.2504.B00.2112100444    12/10/2021
CPUzMicrocode: 413h

Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries.

2023010301 / 03.01.2023 / Embedded / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

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