Address Book
 

AERS
 

Flex Power Modules
 

Danisense
 

BINDER
 

Parker Hannifin
 

DANFOSS
 

MOXA
 

Alliance Memory
 

Intelliconnect (Europe) Ltd.
 

KIOXIA Europe GmbH
 

Antenova Ltd
 

Friedrich Lütze GmbH
 

Analog Devices
 

ASRock Industrial
 

NVIDIA

26.03.2023 0:07:21
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
IRE-Q12
 
120W eighth brick DC-DC converters for r

New Generation of Non-Silicone, High-Performance, Dispensable Thermal Gels Now Available from Parker
THERM-A-GAP GEL 40NS delivers a combination of physical and thermal properties that is unmatched in the industry, all within a unique silicone-free binder system

High Wycombe, Bucks, UK, 25th January 2023The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, has unveiled THERM-A-GAP™ GEL 40NS, the next iteration in its industry-leading line of silicone-free, thermally conductive gels. This one-component, low-outgassing material features a special formulation to meet the stringent requirements of silicone-sensitive applications such as optical equipment, camera modules, high-performance sensors and data storage devices.

 Offering heat-transfer performance of 4.0 W/m-K thermal conductivity, users of THERM-A-GAP™ GEL 40NS will discover a thermally reliability material in an ultra-low compression force package: it deforms easily under assembly pressure, minimising stress on components, solder joints and leads. The fully cured and dispensable product requires no mixing and maintains the traditional advantages of Parker Chomerics’ line of thermal gels, providing seamless integration into high-volume, automated assembly applications, as well as rework and field repair situations.

 THERM-A-GAP™ GEL 40NS reliably conforms to rough surface irregularities, displaces air gaps and takes up manufacturing tolerances on heat-generating components. The product provides very low thermal impedance at bond lines as thin as 0.15 mm (0.006”).

 “The consumer electronics, automotive and telecommunications industries have spent years waiting for a high-performance, reliable, non-silicone solution that fits into the portfolio of dispensable and cost-effective thermal interface materials,” says Ben Nudelman, global market manager, Chomerics Division. “We’re beyond excited to launch a product that finally meets these demands and has a combination of physical and thermal properties that is unmatched in the industry today.”

 Requiring no secondary curing, THERM-A-GAP™ GEL 40NS is the ideal solution for applications that must reduce the risks associated with silicone oil migration or contamination, or for devices manufactured in silicone-free facilities.

 “The global electronic assembly and manufacturing ecosystem continues to adopt strict material controls,” explains Nudelman. “This, along with advances in optical data transmission, electric vehicle (EV) technology and state-of-the-art sensors, leads to nearly limitless applications for our newest thermal material.”

 Stock of THERM-A-GAP™ GEL 40NS is in place across Europe in standard cartridge sizes ranging from 10 cc syringes to 3.8 litre (1 gallon) pails.

 Learn more about the new THERM-A-GAP product at www.parker.com/chomerics.

2023012701 / 10.02.2023 / Various / Parker Hannifin /

New Generation of Non-Silicone, High-Performance, Dispensable Thermal Gels Now Available from Parker
THERM-A-GAP GEL 40NS delivers a combination of physical and thermal properties that is unmatched in the industry, all within a unique silicone-free binder system

Company of the week

AERS

Interesting video


Video Report from AMPER 2022


"Electronics is Magic" Adam Kuczyński Talks About Innovations - TME on Electronica 2022 [INTERVIEW]


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Address Book


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool



Calendary
SMTconnect, 9.-11.5.2023, Nuremberg, DE
PCIM Europe, 9.-11.5.2023, Nuremberg, DE
sps Italia, 13.-15.5.2023, Fiere di Parma, IT
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813