Address Book
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation
 

Giada
 

RS group
 

NOKIA
 

ANRITSU
 

Digi-Key Electronics
 

AERS

26.04.2024 0:07:12
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

New Generation of Non-Silicone, High-Performance, Dispensable Thermal Gels Now Available from Parker
THERM-A-GAP GEL 40NS delivers a combination of physical and thermal properties that is unmatched in the industry, all within a unique silicone-free binder system

High Wycombe, Bucks, UK, 25th January 2023The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, has unveiled THERM-A-GAP™ GEL 40NS, the next iteration in its industry-leading line of silicone-free, thermally conductive gels. This one-component, low-outgassing material features a special formulation to meet the stringent requirements of silicone-sensitive applications such as optical equipment, camera modules, high-performance sensors and data storage devices.

 Offering heat-transfer performance of 4.0 W/m-K thermal conductivity, users of THERM-A-GAP™ GEL 40NS will discover a thermally reliability material in an ultra-low compression force package: it deforms easily under assembly pressure, minimising stress on components, solder joints and leads. The fully cured and dispensable product requires no mixing and maintains the traditional advantages of Parker Chomerics’ line of thermal gels, providing seamless integration into high-volume, automated assembly applications, as well as rework and field repair situations.

 THERM-A-GAP™ GEL 40NS reliably conforms to rough surface irregularities, displaces air gaps and takes up manufacturing tolerances on heat-generating components. The product provides very low thermal impedance at bond lines as thin as 0.15 mm (0.006”).

 “The consumer electronics, automotive and telecommunications industries have spent years waiting for a high-performance, reliable, non-silicone solution that fits into the portfolio of dispensable and cost-effective thermal interface materials,” says Ben Nudelman, global market manager, Chomerics Division. “We’re beyond excited to launch a product that finally meets these demands and has a combination of physical and thermal properties that is unmatched in the industry today.”

 Requiring no secondary curing, THERM-A-GAP™ GEL 40NS is the ideal solution for applications that must reduce the risks associated with silicone oil migration or contamination, or for devices manufactured in silicone-free facilities.

 “The global electronic assembly and manufacturing ecosystem continues to adopt strict material controls,” explains Nudelman. “This, along with advances in optical data transmission, electric vehicle (EV) technology and state-of-the-art sensors, leads to nearly limitless applications for our newest thermal material.”

 Stock of THERM-A-GAP™ GEL 40NS is in place across Europe in standard cartridge sizes ranging from 10 cc syringes to 3.8 litre (1 gallon) pails.

 Learn more about the new THERM-A-GAP product at www.parker.com/chomerics.

2023012701 / 10.02.2023 / Various / Parker Hannifin /

New Generation of Non-Silicone, High-Performance, Dispensable Thermal Gels Now Available from Parker
THERM-A-GAP GEL 40NS delivers a combination of physical and thermal properties that is unmatched in the industry, all within a unique silicone-free binder system

Company of the week

BALLUFF

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.



Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813