Address Book
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation
 

Giada
 

RS group
 

NOKIA
 

ANRITSU
 

Digi-Key Electronics
 

AERS

22.04.2024 0:07:17
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

This ecosystem empowers OEMs in the automation and machine building markets to rapidly bring their solutions to the next levels of computing performance, artificial intelligence (AI), IoT connectivity, real-time responsiveness, security, user experience (UX), and cost savings through hardware consolidation. Highlights of the congatec showcase are the new high-performance COM-HPC Computer-on-Modules ecosystem alongside solutions platforms for smart vision in cooperation with Hacarus and Basler; artificial intelligence in cooperation with Hailo, building a complete high-performance landscape. Utilizing such application-ready edge computing platforms, compiled by strong ecosystem partners who are all leading in their sectors, frees OEMs from doing labor- and cost-intensive groundwork, thereby accelerating product engineering and time to market.

 

New COM-HPC Computer-on-Modules

The presented portfolio ranges from high-performance COM-HPC Server-on-Modules to ultra-compact and brand-new COM-HPC Client-on-Modules that are hardly larger than a credit card. Together with matching and tailored cooling solutions, carrier boards, and design-in services, congatec now provides everything designers need for their next generation of high-performance embedded and edge computing platforms to accelerate the digital transformation. And with the new COM‑HPC Mini standard, even the most space-constrained solutions can benefit from a high-performance boost and a significantly larger number of new high-speed interfaces with the congatec portfolio. Thus, OEMs can migrate entire product families to the new PICMG standard – without significant modification of the internal system design and housing. Two reference system designs demonstrate how easy it is for OEMs to get their applications productive faster by using pre-validated and proven system concepts that can be adapted more quickly to their specific needs instead of developing everything from scratch.
 

  • The embedded edge server flagship of the COM-HPC presentations is a reference system design with heat pipe cooling for harsh industrial environments. It is based on the conga-HPC/sILH Server-on-Modules with Intel Xeon D processors (codenamed Ice Lake D) and offers advanced networking capabilities with 8x 25Gb Ethernet. With up to 20 cores it is predestined for workload consolidation in production cells as well as for orchestrating communications in IoT network infrastructures. Other use cases include data aggregators and secure gateways between OT and IT. Support for Real-Time Systems' real-time hypervisor technology also enables mixed-critical application scenarios.
     
  • For industrial workstation performance, congatec presents a robust COM-HPC client reference system design based on the conga-HPC/cRLP Client-on-Modules with 13 Gen Intel Core processors with up to 14 cores. Typical use cases of this fanless design are high-performance applications with real-time control, artificial intelligence, HMI visualization and edge gateway functionalities, all running on a single platform.

 

Further information on congatec’s COM-HPC offerings can be found at:
https://www.congatec.com/en/technologies/com-hpc/

 

Artificial intelligence in cooperation with Hailo

In a brand-new cooperation with AI processor vendor Hailo, congatec presents a demo with 4 cameras connected to the 3.5-in single board computer (SBC) conga-JC370 hosting one Hailo-8 AI module. Featuring up to 26 tera-operations per second (TOPS), the Hailo-8 edge AI processor significantly outperforms all other edge AI processors. Compared to other leading solutions, its area and power efficiency are superior by a considerable order of magnitude – at a size smaller than a penny, even including the required memory. With an architecture that takes advantage of the core properties of neural networks, the neural chip allows edge devices to run deep learning applications at full scale more efficiently, effectively, and sustainably than other AI chips and solutions, while significantly lowering costs. Hosted on an application-ready 3.5-in SBC equipped with deep-learning pre-trained modules for various computer vision tasks, engineers can rapidly create prototypes on this new AI platform.
 

Smart vision in cooperation with Hacarus and Basler

The smart vision showcase compiled in cooperation with the Japanese AI experts at Hacarus consists of an efficient Sparse Modeling Kit based on machine learning algorithms. Sparse modeling needs little training data to make highly accurate predictions. This is an advantage for vision-based inspection systems, among others, because the reject rate is naturally lower when manufacturing quality is high. With sparse modeling it is possible to create a new inspection model starting with 50 or even fewer images. This is significantly less than the 1,000 or more images required for traditional AI. The Sparse Modeling Kit can be used stand-alone or as an add-on to existing inspection systems. Primary customers are vision system providers and system integrators. Another group of users includes machine and system builders who want to use vision-based AI in their devices but have been reluctant to do so up to now, because the wide variety of individual customer installations requires algorithms to be adapted, which was previously too costly.

Further information on the benefits of sparse modeling can be found in this Whitepaper.
https://www.congatec.com/en/technologies/sparse-modeling-slim-but-powerful-artificial-intelligence-for-embedded-systems/

2023031201 / 07.03.2023 / Embedded / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

Company of the week

BALLUFF

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.



Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813