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Infineon presents highly integrated XENSIV™ 60 GHz radar sensor for consumer electronics, IoT applications, and healthcare devices

Infineon Technologies AG introduces the new XENSIV™ 60 GHz radar sensor BGT60UTR11AIP. With a compact size of only 16 mm², it is the smallest 60 GHz radar sensor with antennas in package (AIP) on the market and is specifically designed for integration into the smallest devices. This makes the sensor ideal for vital sensing (heart and respiratory rate) and healthcare devices such as baby monitors and sleep trackers. It is also suitable for consumer electronics such as laptops, TVs and cameras, as well as smart home and building devices such as air conditioners, thermostats and smart doorbells. The radar sensor can also be used in industrial applications including robotics and tank level measurement.

The monolithic microwave integrated circuit (MMIC) is based on Infineon’s B11 SiGe BiCMOS technology, which ensures excellent radio frequency (RF) performance. The chip features an ultra-wide bandwidth of 5.6 GHz and a ramp speed of 400 MHz/µs. As a result, the sensor enables high-resolution frequency modulated continuous wave (FMCW) operation with sensitive presence and motion detection at a range of up to 15 m (50 ft). In addition, the sensor enables precise distance measurement, 1D gesture and vital sign detection, all with sub-mm motion detection capabilities. The integrated antennas provide a ±60° field of view. In addition, an integrated state machine enables real-time data acquisition without processor interaction. The MMIC also includes a 12-bit analog-to-digital converter (ADC) with a sampling rate of up to 4 MSPS (Mega Samples per Second).

The MMIC’s built-in broadcast mode allows multiple chips to be synchronized. It also includes on-chip sensors for measuring Tx output power and temperature. In addition, the sensor features ultra-low power operation enabled by hardware deep sleep mode. Its high integration level makes this MMIC ideal for optimizing system costs.

Availability

The XENSIV 60 GHz radar BGT60UTR11AIP can be ordered now and will begin shipping in the fourth quarter of 2023. More information is available at www.infineon.com/BGT60UTR11AIP. For an initial evaluation of the radar sensor, Infineon provides the DEMO BGT60UTR11AIP and the Radar Development Kit (RDK), both available for download from the Infineon Developer Center (IDC).

In addition, Infineon’s associated partner RFbeam Microwave has integrated the BGT60UTR11AIP radar transceiver into its new V-LD1 level measurement module. RFbeam also offers an evaluation kit for the V-LD1 module, which can be used in conjunction with a lens to focus the radar beam to an area of 8 x 8°. Further information is available at https://www.infineon.com/cms/en/partners/partner-news/rfbeam/.

2023073101 / 31.07.2023 / Electronic-components / Infineon Technologies AG /

New industrial CoolSiC™ MOSFETs 650 V G2 in TOLT and Thin-TOLL package increase system power density
The electronics industry is witnessing a significant shift towards more compact and powerful systems, driven by technological advancements and a growing focus on decarbonization efforts.

Infineon unveils CoolSiC™ MOSFETs 400 V redefining power density and efficiency in AI server power supplies

Infineon presents XENSIV™ TLE49SR angle sensor family with outstanding stray field robustness
Infineon Technologies AG introduces the new XENSIV™ TLE49SR angle sensor family, which combines excellent stray field immunity with high accuracy. The sensors are ideal for applications of safety-critical automotive chassis systems such as electric power steering and vehicle height leveling.

Infineon introduces PSoC™ 4 HVPA-144K microcontroller for automotive battery management systems

Infineon provides FOXESS with power semiconductors to improve efficiency and power density of energy storage applications

Infineon launches next-generation ZVS flyback converter chipset for advanced USB-C PD adapters and chargers
The growing popularity of USB-C power delivery (PD) charging increases the demand for compatible chargers. Users now seek powerful yet compact adapters.

Infineon Lighting Shoe: Infineon develops worldwide unique shoe prototype with adidas that listens to music and reacts to it with lighting effects

Infineon’s single-chip solution for NFC lock applications enables KISS to take self-storage to the next level with new smart lock solution

Infineon introduces new automotive 60 V and 120 V OptiMOS™ 5 in TOLx packages for 24 V-72 V supplied high power ECUs
The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified. Therefore, the automotive market for Electronic Control Units (ECUs) powered by 24 V-72 V is expected to keep growing in the coming years.

Infineon presents highly integrated XENSIV™ 60 GHz radar sensor for consumer electronics, IoT applications, and healthcare devices

Engine management and pneumatic seat systems: Infineon launches two XENSIV™ barometric air pressure sensors

Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions

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