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TDK offers mechanically decoupled ultrasonic modules for collision avoidance
TDK Corporation presents the ultrasonic sensor module USSM1.0 PLUS-FS, in which the sensor element is mechanically decoupled from the housing. This makes the IP65/67 protected sensor with the order number B59110W2111W032 immune to external mechanical vibrations that can falsify the measurement result. The module, which is supplied with a nominal voltage of 12 V, can be mounted in a front chassis via a M19 thread with a locking nut or via snap hooks.

TDK Corporation presents the ultrasonic sensor module USSM1.0 PLUS-FS, in which the sensor element is mechanically decoupled from the housing. This makes the IP65/67 protected sensor with the order number B59110W2111W032 immune to external mechanical vibrations that can falsify the measurement result. The module, which is supplied with a nominal voltage of 12 V, can be mounted in a front chassis via a M19 thread with a locking nut or via snap hooks.

Actuated via a driver and an integrated piezoelectric disk, the integrated signal processor ASIC can calculate the signal propagation time with a repetition rate of up to 50 samples/s. This allows measuring distances from 18 cm to 200 cm; in pitch-and-catch mode with several modules, even measuring distances of 4 cm are feasible. The field-of-view (FoV) of the USSM1.0 PLUS-FS, which the customer can optimize to suit his needs, is ±35°. Thus, individual measurement scenarios can also be programmed. The sensor module is suitable for a wide range of brightness conditions, including full sunlight, and measures very accurately regardless of the color and translucence of the target object.

The ultrasonic modules are particularly well suited for distance measurement and obstacle detection under difficult environmental conditions in autonomous mobile robots (AMR) or autonomous guided vehicles (AGVs).

Features & Applications Main applications
  • Systems for obstacle detection and collision avoidance in mobile systems (e.g., AGVs, AMRs)
  • Distance measurement in stationary systems (e.g., level measurement)
Main features and benefits
  • Sensor module with integrated ASIC for measurements in air
  • Robust package mechanically decoupled from the sensor element
  • Measurement range 18 cm to 200 cm (4 cm in pitch-and-catch mode)
  • Sample rate up to 50 samples/s
  • Individual measuring scenarios programmable

Further information on the products can be found under  www.tdk-electronics.tdk.com/en/ultrasonic_sensor_module

2023091403 / 14.09.2023 / Electronic-components / TDK Corporation /

TDK introduces new stray-field robust 3D-magnetic position sensor with capabilities for processing external signals

TDK announces new 3-axis accelerometer, finalizing transition of SmartAutomotive™ non-safety product family to 105°C

TDK introduces 3D HAL® technology-based position sensor with analog output and SENT interface

TDK offers mechanically decoupled ultrasonic modules for collision avoidance
TDK Corporation presents the ultrasonic sensor module USSM1.0 PLUS-FS, in which the sensor element is mechanically decoupled from the housing. This makes the IP65/67 protected sensor with the order number B59110W2111W032 immune to external mechanical vibrations that can falsify the measurement result. The module, which is supplied with a nominal voltage of 12 V, can be mounted in a front chassis via a M19 thread with a locking nut or via snap hooks.

TDK offers compact high-current chokes for automotive and industrial applications
TDK Corporation presents the B82559A*A033 series of new shielded EPCOS ERU33 high-current chokes for through-hole mounting. Designed for very high saturation currents from 32 A to 83 A at 100 °C, the six new types cover a range of inductance values from 3.2 µH to 10 µH.

EMC Components: TDK develops industry’s first high-reliability chip beads for automotive
TDK Corporation announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ℃ environments.

Surge protection: Failsafe chip varistors for automotive battery lines
TDK Corporation presents a new range of Open Mode chip varistors for electronic automotive assemblies that are directly connected to the battery. The new chip varistors offer reliable protection against transient surge voltages according to ISO 7637-2, and meet the failsafe requirements according to the VW standard VW 80808. Even when subject to excessive bending stress, short-circuits are avoided, which is particularly important for unswitched battery terminals (e.g. terminal 30).

Inductors: Compact dual inductors with high saturation current
TDK Corporation has extended its range of dual inductors to include the new EPCOS series B82477D6*. The seven series types cover an inductance range from 2 x 3.9 µH to 2 x 47 µH and are designed for maximum rated currents from 2.83 A to 7.05 A. A special feature of the inductors, which are certified according to AEC-Q200 and compatible with RoHS, are the high saturation currents of up to 16.1 A.

Aluminum electrolytic capacitors: Compact design with high ripple current capability
TDK Corporation (TSE:6762) presents the new B43707* and B43727* series of EPCOS aluminum electrolytic capacitors with screw terminals. They are designed for rated voltages of between 400 V DC and 450 V DC and cover a capacitance range from 1800 µF to 18,000 µF.

TDK announces world’s first MIPI standard SoundWire® microphone
TDK Corporation (TSE: 6762) introduces the world’s first MIPI Standard SoundWire® microphone for mobile, IoT and other consumer devices. This multimode microphone pushes the boundaries of digital microphone acoustic performance while providing advanced feature sets with very low power.

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