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AMD Ryzen™ based congatec COM Express mo

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec – a leading vendor of embedded and edge computing technology – introduces six new COM Express Compact Computer-on-Modules based on 13th Gen Intel Core processor featuring highest ruggedness. They are designed to withstand even extreme temperature ranges of -40°C to +85°C. Equipped with soldered RAM, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in harsh environments up to highest railway standards. Target OEM applications for the new range of Computer-on-Modules based on the new Intel microarchitecture codenamed Raptor Lake are manned and unmanned rail and off-road vehicles for mining, construction, agriculture, forestry, as well as any other mobility application off paved roads. Shock and vibration resistant stationary devices and outdoor applications with high temperature fluctuations are further important application areas as digitization requires critical infrastructure protection (CIP) against earthquakes and other mission-critical events.

With up to 14 cores and 20 threads, seconded by ultra-fast LPDDR5x memory, the 13th Gen Intel Core processors deliver excellent parallel processing and multitasking options for connected outdoor, rail and off-road applications within optimized power-budgets. System designs will also become more sustainable due to improved performance per watt ratios and reduced power costs over their lifetime. These features are enabled by the Intel hybrid architecture, which is available for the first time in a highly rugged design and combines two core microarchitectures – Performance-cores (P-cores) and Efficient-cores (E-cores) – on a single processor. Moreover, the soldered LPDDR5x memory supports in-band error code correction (IBECC), so no special memory is needed for mission critical applications requiring highest data integrity, which also reduces the components to be procured. Support for Time Sensitive Networking (TSN) and Time Coordinated Computing (TCC) complete the industrial grade feature set.

The modules are supported by congatec’s high-performance ecosystem including highly efficient active and passive cooling solutions; optional conformal coating for protection against moisture, thermal shock, static, vibration, and contamination; evaluation carrier boards as well as the carrier board schematics. For virtual machine deployments and workload consolidation in edge computing scenarios customers can order the modules with pre-evaluated real-time hypervisor technology from Real-Time Systems. The hypervisor supports real-time operation and adds no additional latency. Additional service offerings including shock and vibration tests for custom system designs, temperature screening, and high-speed signal compliance testing, along with design-in services, and all required training sessions to simplify the use of congatec’s embedded computer technologies round-off the ecosystem.

The ultra-rugged COM Express Compact Type 6 modules based on the 13th Gen Intel Core (code name Raptor Lake) are available in the following standard configurations with customization options upon request:

Processor Cores/
(P + E)
Max. Turbo Freq. [GHz]
P-cores / E-cores
Base Freq. [GHz]
P-cores / E-cores
Threads GPU Execution Units [EU] CPU Base Power [W]
Intel Core i7-13800HRE 14
(6 + 8)
5.0 /4.0 2.5 / 1.8 20 96 45
Intel Core i5-13600HRE 12
(4 + 8)
4.8 / 3.6 2.7 / 1.9 16 80 45
Intel Core i7-1370PRE 14
(6 + 8)
4.8 / 3.7 1.9 / 1.2 20 96 28
Intel Core i5-1350PRE 12
(4 + 8)
4.6 / 3.4 1.8 / 1.3 16 80 28
Intel Core i3-1320PRE 8
(4 + 4)
4.5 / 3.3 1.7 / 1.2 12 48 28
Intel Core i7-1365URE 10
(2 + 8)
4.9 / 3.7 1.7 / 1.2 12 96

15

Further information on the new conga-TC675r COM Express Compact modules can be found here: www.congatec.com/en/products/com-express-type-6/conga-tc675r/

2023111501 / 14.11.2023 / Electronic-components / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

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