Address Book
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation
 

Giada
 

RS group
 

NOKIA
 

ANRITSU
 

Digi-Key Electronics
 

AERS

24.06.2024 0:07:21
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec – a leading vendor of embedded and edge computing technology – is introducing its latest range of COM Express Compact modules based on the Intel® Core™ Ultra processors. Providing a unique combination of heterogeneous compute engines, including CPU, GPU and NPU, the new modules are an ideal fit to run demanding AI workloads at the edge.
 

Next to the powerful P-cores and efficient E-cores for general computing and the high-performance Intel® Arc™ GPU for graphics-intensive tasks, the integrated Neural Processing Unit (NPU) called Intel® AI Boost contributes advanced neural processing capabilities to the overall computational architecture. The integrated NPU enables highly efficient integration of advanced artificial intelligence workloads at lower system complexity and costs than discrete accelerators. This makes the new Intel Core Ultra processor-based Computer-on-Modules especially beneficial for combining high-performance real-time computing with powerful AI capabilities in surgery robots and medical imaging and diagnostic systems, where automatically generated critical findings can support medical personnel. Other application targets are situational awareness in industrial applications such as inspection systems, stationary robotic arms, autonomous mobile robots (AMRs), and autonomous guided vehicles (AGVs), to name just a few. 
 

“The new conga-TC700 COM Express Compact Computer-on-Modules provide application-ready AI capabilities in a plug-and-play form factor. Its ecosystem of customer solution-focused products and services significantly improves the time-to-market for implementing the latest state-of-the-art x86 with powerful AI capabilities as required in industrial process control, microgrid controller, medical ultrasound and x-ray, automated check-out terminals, powerful AMRs, and many more,” says Tim Henrichs, VP Global Marketing & Business Development at congatec. “OEMs can simply upgrade existing applications by exchanging the module and instantly gain access to cutting-edge AI technologies. It has never been easier to integrate artificial intelligence in x86-based systems.”
 

The feature set at a glance

The new conga-TC700 COM Express Compact Computer-on-Modules with Intel Core Ultra processors (code named Meteor Lake) are among the most power-efficient x86 client SoCs available on the market. Up to 6 P-Cores, up to 8 E-Cores, and 2 Low Power E-Cores support up to 22 threads, making it possible to consolidate distributed devices onto a single platform for the lowest total cost of ownership. The SoC-integrated Intel Arc GPU with up to 8 Xe Cores and up to 128 EUs can handle stunning graphics up to 2x 8K resolution and ultra-fast GPGPU-based vision data (pre)processing. The integrated NPU Intel AI Boost executes machine learning algorithms and AI inferences particularly efficient. Up to 96 GB DDR SO-DIMM with in-band ECC at 5600 MT/s contributes to power-efficient high data throughput and low latency.

The modules are supported by congatec’s OEM solution-focused high-performance ecosystem, including highly efficient active and passive cooling solutions and ready-to-use evaluation carrier boards. Customers can order the modules with pre-evaluated real-time hypervisor technology from Real-Time Systems for virtual machine deployments and workload consolidation in edge computing scenarios. Service offerings include shock and vibration tests for custom system designs, temperature screening, and high-speed signal compliance testing, along with design-in services and all required training sessions to simplify the use of congatec’s embedded computer technologies to round off the ecosystem.

The new conga-TC700 COM Express Compact Type 6 modules support the embedded temperature range from 0 °C to 60 °C and are available in the following standard configurations:

Processor P-cores / E-cores /
Threads
Max. Turbo Freq. [GHz]
P-cores / E-cores
Base Freq. [GHz]
P-cores / E-cores
Intel Smart Cache [MB] Graphics [Execution Units] CPU Base Power [W]
Intel Core Ultra 7 155H processor 6/10/22 4.8 / 3.8 1.4 / 0.9 24 128 28
Intel Core Ultra 7 155U processor 2/10/14 4.8 / 3.8 1.7 / 1.2 12 64 15
Intel Core Ultra 5 125H processor 4/10/18 4.5 / 3.6 1.7 / 1.2 18 112 28
Intel Core Ultra 5 125U processor 2/10/14 4.3 / 3.6 1.3 / 0.8 12 64 15

All features of the new Intel Core Ultra processor-based conga-TC700 COM Express Compact modules can be found here

For more information on the innovative Intel Core Ultra processor platform please click here

You can experience these and other innovations at embedded world from 9-11 April 2024:

Visit congatec in Hall 3 at Stand 241.

 

2023121701 / 17.12.2023 / Embedded / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

Company of the week

BALLUFF

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.



Calendary
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813