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Microchip Earns Certification in ISO/SAE 21434 Road Vehicle—Cybersecurity Engineering Standard from UL Solutions
Designing with certified security products can help Tier 1s and OEMs prove cybersecurity risk management compliance

As everything from infotainment to engine systems in the automotive industry becomes more dependent on wireless and in-vehicle network connectivity, the need for robust cybersecurity measures has increased. The ISO/SAE 21434 standard has emerged to set requirements for road vehicle cybersecurity risk management processes. These cybersecurity requirements help regulate automotive products across the complete product lifecycle—from concept through design, production, maintenance and decommissioning. Adhering to these standards, Microchip Technology’s (Nasdaq: MCHP) corporate processes associated with specific automotive work products have recently been audited by a third party, UL Solutions, and certified as compliant to ISO/SAE 21434.

Developed by the International Organization for Standardization (ISO) in conjunction with the Society of Automobile Engineers (SAE) International, the ISO/SAE 21434 standard was developed to help organizations define cybersecurity policies and manage risk. It is a demanding specification with 45 security categories, known as work products, each of which specifies a unique set of requirements that encompass all aspects of designing electrical and electronic systems for road vehicles, from ICs and software to firmware and libraries.

The ISO/SAE 21434 designation also confirms that a certified corporate cybersecurity management system is in place. This verifies that cybersecurity is a priority focus at the organization, from executive leadership to all organizational disciplines including the design, test, product, applications, marketing, quality, verification and validation teams. Stakeholders involved in the product lifecycle are required to complete cybersecurity training and meet designated qualifications. A Threat Analysis and Risk Assessment (TARA) methodology is also incorporated at multiple stages of the product lifecycle when devices will be integrated into automotive cybersecurity-related platforms.

“Security is a core pillar at Microchip and the ISO/SAE 21434 certification is proof of our dedication to maintaining high standards in automotive cybersecurity,” said Matthias Kaestner, corporate vice president of Microchip's automotive business. “Our customers can be confident that Microchip is a trusted security advisor with the appropriate expertise to guide them through their automotive cybersecurity design journey.”

While each OEM is responsible for proving compliance at the vehicle level, ISO/SAE 21434 encourages all companies in the production ecosystem to play a role in proactively helping manage cybersecurity threats. Customers utilizing electronic control units that incorporate Microchip’s security products, designed within the ISO/SAE 21434 certified process framework, can be relieved of the arduous task of reviewing thousands of pages of process documentation to determine compliance. This reduces the burden placed on Tier-1s and OEMs to prove they have a strong foundation in security.

To learn more about Microchip’s ISO/SAE 21434 certification and automotive products, visit the automotive security page on the Microchip website.

2024022102 / 21.02.2024 / Various / Microchip Technology Inc. /

Microchip Technology Releases Qi® v2.0 Standards-Compliant dsPIC33-Based Reference Design
Wireless dual-pad charging design supports both Extended Power Profile and Magnetic Power Profile with a single controller

Microchip Technology Releases Next Generation of Easily Configurable Enterprise Storage Backplane Management Processors for Data Center and Storage Applications
Updated EEC1005 family of Universal Backplane Management devices complies with latest SFF-TA-1005 V. 1.4 specifications

Microchip Launches New dsPIC® DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device
A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market

Microchip Expands its mSiC™ Solutions with the 3.3 kV XIFM Plug-and-Play mSiC Gate Driver to Accelerate the Adoption of High-Voltage SiC Power Modules
The highly integrated 3.3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration

Microchip’s Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
Cost-sensitive development platform helps student, beginner and seasoned designers work with emerging technologies

TimeProvider® 4500 Series Is the Industry’s First Grandmaster to Provide High-Speed Network Interfaces up to 25 Gbps
Extends Microchip’s IEEE®-1588 grandmaster portfolio and enables precise time accuracy to less than one nanosecond

Microchip Earns Certification in ISO/SAE 21434 Road Vehicle—Cybersecurity Engineering Standard from UL Solutions
Designing with certified security products can help Tier 1s and OEMs prove cybersecurity risk management compliance

The Next Evolutionary Step in Customizable Logic, Microchip Releases PIC16F13145 Family of MCUs
New Configurable Logic Block (CLB) module offers tailored hardware solutions and helps eliminate the need for external logic components

Microchip Launches 10 Multi-Channel Remote Temperature Sensors
MCP998x family represents one of the largest automotive-grade remote temperature sensor portfolios available from a single vendor

Next-Generation Family of Ethernet Switches Features Time Sensitive Networking and Scalable Port Bandwidths from 46 Gbps to 102 Gbps
Microchip’s LAN9694, LAN9696 and LAN9698 devices are integrated with High-availability Seamless Redundancy (HSR) and Parallel Redundancy Protocol (PRP) for ease of design

Microchip Launches AVR® EB Family of Microcontrollers to Reduce Noise, Vibration and System Harshness in BLDC Applications
Offers a smaller, more cost-effective solution for sophisticated waveform control with increased efficiency

Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing
Microchip’s SP1F and SP3F power modules are highly configurable in Silicon Carbide (SiC) or Silicon (Si) technology and now available with Press-Fit terminals

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