Address Book
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation
 

Giada
 

RS group
 

NOKIA
 

ANRITSU
 

Digi-Key Electronics
 

AERS

29.04.2024 5:56:30
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

Microchip Technology Releases Qi® v2.0 Standards-Compliant dsPIC33-Based Reference Design
Wireless dual-pad charging design supports both Extended Power Profile and Magnetic Power Profile with a single controller

As major charger manufacturers, including those in the automotive industry, are working to implement Qi® v2.0 (Qi2) standards, Microchip Technology (Nasdaq: MCHP) has released a Qi 2.0 dual-pad wireless power transmitter reference design. Powered by a single dsPIC33 Digital Signal Controller (DSC), the Qi2 reference design offers efficient control for optimized performance. A key feature of the new Qi2 standard, recently released by the Wireless Power Consortium (WPC), is the introduction of a Magnetic Power Profile (MPP) with support for magnetic alignment between the transmitter and the receiver. The DSC's flexible software architecture enables the support of a combination of MPP and Extended Power Profile (EPP) of Qi 2.0 with one controller.

Utilizing the Qi2 reference design helps minimize customer risk in certifying their final product, which is required to pass through the Qi certification process. As it integrates several of Microchip’s automotive-qualified parts, the dual-pad charger also meets automotive standards for reliability and safety. The automotive-grade hardware and software solution enables easier automotive integration with support for AUTomotive Open System Architecture (AUTOSAR®) and AUTOSAR Microcontroller Abstraction Layer Architecture (MCALs), functional safety and more. An integrated CryptoAuthentication™ IC provides security to meet the stringent authentication requirement of Qi standards.

“The dual-pad reference design provides manufacturers of automotive charger modules with the flexibility and programmability to optimize MPP Power Loss Accounting (MPLA) and Q-Based Foreign Object Detection (Q-FOD) and minimize time to certification. It also allows for the seamless integration into the automotive environment,” said Joe Thomsen, vice president of Microchip’s digital signal controllers business unit. “The automotive-grade design and full range of hardware and software support help our customers optimize their end solutions and decrease time to market.” 

As part of the reference design, Microchip can deliver design files and software designed to create an easy design experience and first-pass success. The design includes the dsPIC33 DSC and a TA100/TA010 Trust Anchor secure storage subsystem provisioned by Microchip as a licensed Wireless Power Consortium (WPC) Manufacturer Certificate Authority. Additionally, the design also includes Microchip’s ATA6563 CAN transceiver, MCP14700 gate drivers and MCP16331 and MCP1755 regulators.

Key features:

  • Dual-pad transmitter supporting Qi 2.0
  • MPLA and Q-FOD
  • Thermal power foldback and shutdown
  • Transmitter based on fixed-frequency topology control to optimize EMI/EMC performance
  • Easy integration into automotive environments with CAN FD hardware/software
  • dsPIC33 capable of integrating Near Field Communication (NFC) for card detection/protection and communication
  • UART-USB communication and GUI for advanced reporting/debugging of data packets
  • Hardware reconfigurable and capable of supporting most transmitter topologies

For more information or to request a demonstration or design files contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

2024041403 / 16.04.2024 / Electronic-components / Microchip Technology Inc. /

Microchip Technology Expands Its Serial SRAM Portfolio to Larger Densities and Increased Speeds
Product line offers a lower-cost alternative to parallel SRAM with up to 4 Mb density and 143 MHz SPI/SQI™ communications

Microchip Technology Expands TrustFLEX Family with CEC1736 Real-time Platform Root of Trust Devices
TrustFLEX devices along with the Trust Platform Design Suite tool will simplify the enablement of root of trust from concept to production in wide range of applications

Microchip Technology Releases Qi® v2.0 Standards-Compliant dsPIC33-Based Reference Design
Wireless dual-pad charging design supports both Extended Power Profile and Magnetic Power Profile with a single controller

Microchip Technology Releases Next Generation of Easily Configurable Enterprise Storage Backplane Management Processors for Data Center and Storage Applications
Updated EEC1005 family of Universal Backplane Management devices complies with latest SFF-TA-1005 V. 1.4 specifications

Microchip Launches New dsPIC® DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device
A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market

Microchip Expands its mSiC™ Solutions with the 3.3 kV XIFM Plug-and-Play mSiC Gate Driver to Accelerate the Adoption of High-Voltage SiC Power Modules
The highly integrated 3.3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration

Microchip’s Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
Cost-sensitive development platform helps student, beginner and seasoned designers work with emerging technologies

TimeProvider® 4500 Series Is the Industry’s First Grandmaster to Provide High-Speed Network Interfaces up to 25 Gbps
Extends Microchip’s IEEE®-1588 grandmaster portfolio and enables precise time accuracy to less than one nanosecond

Microchip Earns Certification in ISO/SAE 21434 Road Vehicle—Cybersecurity Engineering Standard from UL Solutions
Designing with certified security products can help Tier 1s and OEMs prove cybersecurity risk management compliance

The Next Evolutionary Step in Customizable Logic, Microchip Releases PIC16F13145 Family of MCUs
New Configurable Logic Block (CLB) module offers tailored hardware solutions and helps eliminate the need for external logic components

Microchip Launches 10 Multi-Channel Remote Temperature Sensors
MCP998x family represents one of the largest automotive-grade remote temperature sensor portfolios available from a single vendor

Next-Generation Family of Ethernet Switches Features Time Sensitive Networking and Scalable Port Bandwidths from 46 Gbps to 102 Gbps
Microchip’s LAN9694, LAN9696 and LAN9698 devices are integrated with High-availability Seamless Redundancy (HSR) and Parallel Redundancy Protocol (PRP) for ease of design

Company of the week

BALLUFF

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.



Calendary
sps Italia, Parma, 28.-30.5.2024
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813