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ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

ROHM (TSE: 6963) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company. The new multi-year agreement governs the supply of larger volumes of SiC substrate wafers manufactured in Nuremberg, Germany, for a minimum expected value of $230 million.

Geoff West, EVP and Chief Procurement Officer, STMicroelectronics, commented: “This expanded agreement with SiCrystal will bring additional volumes of 150mm SiC substrate wafers to support our devices manufacturing capacity ramp-up for automotive and industrial customers worldwide. It helps strengthen our supply chain resilience for future growth, with a balanced mix of in-house and commercial supply across regions.”

“SiCrystal is a group company of ROHM, a leading company of SiC, and has been manufacturing SiC substrate wafers for many years. We are very pleased to extend this supply agreement with our longstanding customer ST. We will continue to support our partner to expand SiC business by ramping up 150mm SiC substrate wafer quantities continuously and by always providing reliable quality,” said Dr. Robert Eckstein, President and CEO of SiCrystal, a ROHM group company.

Energy-efficient SiC power semiconductors enable electrification in the automotive and industrial sectors in a more sustainable way. By facilitating more efficient energy generation, distribution and storage, SiC supports the transition to cleaner mobility solutions, lower emissions industrial processes and a greener energy future, as well as more reliable power supplies for resource-intensive infrastructure like data centers dedicated to AI applications.

2024042703 / 27.04.2024 / Electronic-components / ROHM Semiconductor /

ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

ROHM Develops the First Silicon Capacitor BTD1RVFL Series
Achieving the industry’s smallest* size in a mass-produced surface mount package contributes to greater space savings in smartphones and other compact devices

ROHM’s New 4ch/6ch LED Drivers for LCD Backlights: Contribution to Lower Power Consumption in Medium to Large Automotive Displays
Built-in DC and PWM dimming support a wide range of design requirements

ROHM’s New Wireless Charger Modules: Facilitating Wireless Charging in Thin and Compact Devices
ROHM has developed compact wireless charger modules with an integrated antenna board: the BP3621 (transmitter) and the BP3622 (receiver). The new modules allow to add wireless power supply functionality to smaller devices such as smart tags/cards or PC peripherals.

New EMARMOUR™ 2 Channel High-Speed Op Amp
ROHM introduces the availability of a 2 channel high-speed ground sense CMOS op amp, BD77502FVM, optimized for consumer and industrial equipment requiring high-speed sensing – such as industrial measurement and control systems.

New Automotive-Grade Buck-Boost Power Supply Chipset Ensures Stable Performance with Industry-Low* Current Consumption
Novel Quick Buck BoosterⓇ technology improves system stability in start-stop vehicle systems

electronica 2018 – ROHM presents advanced power and energy management technologies for higher power density, efficiency and reliability
VENTURI Formula E Team with new driver Felipe MASSA uses ROHM's Full SiC power module and Gate driver IC

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