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Microchip and Acacia Collaborate to Enable Optimized Terabit-Scale Data Center Interconnect Systems
The companies enable an interoperable coherent optics ecosystem that can help streamline the development of data center interconnect and metro transport systems.

The latest data center architectures and increased traffic are driving higher bandwidth requirements between data centers. To address this challenge, system developers must streamline the development of a new generation of 1.2 Tbps (1.2T) transport solutions across a wide range of client configurations. This requires that today’s terabit-scale Ethernet PHY devices and coherent optical modules interoperate with each other in Data Center Interconnect (DCI) and metro transport networks. Microchip Technology (Nasdaq: MCHP) today announces that it has worked with Acacia to demonstrate the fourth generation of interoperability between Microchip’s META-DX2 Ethernet PHY family and Acacia’s Coherent Interconnect Module 8 (CIM 8).

The two companies’ interoperable devices enable low-power, bandwidth-optimized, scalable solutions for pluggable optics in DCI and transport networks. They deliver three key benefits as they jointly enable high-capacity, multi-rate muxponders for optical transport platforms:

  • Optimized DCI bandwidth: The META-DX2 family, through its META-DX2+ PHY, uses its unique Lambda Splitting feature to split 400 GbE or 800 GbE clients across multiple wavelengths driven by the CIM8 modules. This maximizes the capacity between data centers in rate configurations such as 3x800 GbE over 2x1.2 Tbps waves or 5x400 GbE over 2x1.0 Tbps waves.
  • Reduced design risk: Microchip and Acacia have jointly verified successful SerDes interoperation at up to 112G per lane for Ethernet and OTN clients, which reduces design validation and system qualification requirements.
  • Better support for full bandwidth, multi-rate operation: The META-DX2+ crosspoint and gearbox functions enable 100 GbE to 800 GbE client modules to connect with full bandwidth to CIM8 modules.

“This interoperability extends a long-established partnership with Acacia to help accelerate and optimize the build-out of cloud computing and AI-ready optical networks while reducing development risk for our customers,” said Maher Fahmi, vice president for Microchip’s communications business unit. “Our META-DX2 is the first solution of its kind to integrate 1.6T of encryption, port aggregation and Lambda Splitting into the most compact 112G PAM4 device in the market.”

“With Acacia’s CIM 8 coherent modules verified to interoperate with Microchip’s META-DX2 devices, we see this as a robust solution that reduces system time-to-market,” said Markus Weber, senior director DSP product line management of Acacia. “The compact size and power efficiency of our CIM 8 coherent modules were designed to help network operators deploy and scale capacity of high-bandwidth DWDM connectivity between data centers and throughout transport networks.”

2024091501 / 15.09.2024 / Various / Microchip Technology Inc. /

The Data Center Is Moving to 800V: Microchip and Navitas Are Enabling the Transition
800V-to-6V reference design combines digital power control and hardware-based security to help accelerate high-efficiency OCP rack power development

AnalogAI Selects memBrain™ SAGE Intellectual Property from Silicon Storage Technology® for its First Real-world Edge AI Processors
Proprietary on-device training built to dynamically adapt to real-world environments

Microchip and Marelli Pioneer Open-Standard Display Connectivity Solution for Software-Defined Vehicles
Solution streams graphics and videos from centralized compute systems to automotive displays using standards-based ASA Motion Link connectivity

Plug-and-Play 90W PoE Solution Streamlines Industrial IoT Deployments
Microchip’s industrial-grade Power over Ethernet (PoE) midspans enable device deployment wherever needed, without any switch replacements or upgrades

Microchip Technology, in Collaboration With Micron Technology, Demonstrates High-Performance PCIe® Gen 6 Storage Architecture for AI and Data Center Infrastructure
Switchtec™ PCIe Switches and Micron® 9650 NVMe® solid state drives (SSDs) leverage next generation interface technology to deliver increased bandwidth, low latency, and scalable storage connectivity

Microchip Advances Neural Network Implementation with VectorBlox™ 3.0 Accelerator Software Development Kit
Latest release leverages sparse neural networks to improve performance and enable more efficient edge AI on PolarFire® FPGAs and SoCs

XpressConnect™ PCIe® 6.0 and CXL 3.1 Retimers Address Latency and Signal‑Integrity Challenges in AI Data Centers
Strengthening Microchip Technology’s data center solutions portfolio, the retimers support high‑bandwidth architectures while helping reduce integration complexity

Essential Performance and Real-time Control Without the Baggage
Microchip’s dsPIC33CK Value Line DSCs offer streamlined design for cost-sensitive applications and consistent pricing regardless of order size

Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers
New silicon carbide modules deliver the required thermal performance and efficiency for SSTs to increase power available for token generation

New EX‑423 Evacuated Miniature Crystal Oscillator for Critical Timing in Low- and Battery-Powered Applications
Ruggedized in an ultra-high vacuum for enhanced thermal insulation, the EX-423 delivers stability and RF performance

Next‑Generation 100/1000BASE‑T1 Single Pair Ethernet PHYs Integrate MACsec Security, Time Sensitive Networking and Functional Safety
Microchip’s LAN878x and LAN888x PHY families enable secure, scalable and deterministic Ethernet connectivity for automotive and industrial systems

New BZPACK mSiC® Power Modules Are Designed for Demanding Applications in Harsh Environments
The BZPACK mSiC power modules leverage Microchip’s advanced mSiC technology, incorporating performance of its MB and MC SiC MOSFET families


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electronica 2024, 12.11.-15.11.2024, Munich, DE

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electronica 2026, München, DE, 10.-13.11.2026

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