Address Book
 

Texas Instruments
 

NeoCortec
 

PULSIV
 

MikroElektronika d.o.o.
 

Panasonic Industry
 

Cambridge GaN Devices
 

Traco Power
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL

19.08.2025 0:36:58
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Security
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Training , Trade fairs, Evens
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

TDK announces high-performance IMU to accelerate optical image stabilization adoption
TDK Corporation announces availability of the new InvenSense SmartMotion® ICM-536xx family of high-performance 6-axis IMUs to select customers, bringing high-performance optical image stabilization (OIS) to a wide range of smartphones, tablets, and cameras, for crisp, blur-free photos and videos.
  • TDK’s SmartMotion® high-performance optical image stabilization (OIS) solution brings crisp, blur-free photos and videos to a wide range of smartphones, tablets and cameras
  • The new custom sensing solution for OIS supports superb image stabilization and quality, even in low light
  • Now in production, the ICM-536xx IMU is immediately available to select customers by direct sales inquiry

OIS technology compensates for hand shake and movement, delivering clearer photos and smoother videos in low light, even during zoom or long-exposure shots. As consumer demand for high-quality mobile photography and videography continues to surge, OIS has become a must-have feature in mid-range and flagship smartphones alike. Building on 15 years of leadership in developing premium OIS/EIS custom sensing solutions for select smartphone and camera OEMs, TDK’s new ICM-536xx empowers manufacturers to integrate advanced OIS into a broader range of devices, meeting the growing expectations of content creators and everyday users. It supports up to 6.4 kHz ODR and up to 20-bit data resolution for optimal image quality.

“OIS has been a premium feature historically reserved for high-end smartphones, due to the cost, size, and power consumption of the required sensor technology,” said Pankaj Aggarwal, VP and GM of Consumer and Industrial Motion Sensor Business at InvenSense, a TDK Group company. “TDK’s new ICM-536xx family addresses these challenges head-on, offering a thinner, power-efficient, and mainstream solution without compromising on performance.”

For additional information about the SmartMotion high-performance OIS solution or to request samples by direct sales inquiry, please complete the contact form at invensense.tdk.com/smartmotion or invensense.tdk.com/solutions/mobile, or email inv.sales.us@tdk.com.




Glossary
  • ODR: output data rate
  • OIS: optical image stabilization
  • EIS: electronic image stabilization
  • IMU: inertial measurement unit
  • 6-axis: 3-axis gyroscope + 3-axis accelerometer
  • MEMS: micro-electro-mechanical systems
  • FSR: full scale range
Main applications
  • Smartphones
  • Tablets
  • Motion cameras
Main features and benefits
  • Dual interface for UI and OIS with up to 6.4 kHz ODR
  • Wide FSR: ±32 g/±4000 dps
  • I3C/I²C/SPI serial interface with 1.2 V VDDIO support
  • Thinner package height for placement flexibility
  • FSYNC input for image frame synchronization
  • 20-bit data option for high resolution
  • On-chip free-fall detection as OIS actuator protection mechanism
2025080701 / 07.08.2025 / Electronic-components / TDK Corporation /

TDK announces high-performance IMU to accelerate optical image stabilization adoption
TDK Corporation announces availability of the new InvenSense SmartMotion® ICM-536xx family of high-performance 6-axis IMUs to select customers, bringing high-performance optical image stabilization (OIS) to a wide range of smartphones, tablets, and cameras, for crisp, blur-free photos and videos.

TDK introduces new stray-field robust 3D-magnetic position sensor with capabilities for processing external signals

TDK announces new 3-axis accelerometer, finalizing transition of SmartAutomotive™ non-safety product family to 105°C

TDK introduces 3D HAL® technology-based position sensor with analog output and SENT interface

TDK offers mechanically decoupled ultrasonic modules for collision avoidance
TDK Corporation presents the ultrasonic sensor module USSM1.0 PLUS-FS, in which the sensor element is mechanically decoupled from the housing. This makes the IP65/67 protected sensor with the order number B59110W2111W032 immune to external mechanical vibrations that can falsify the measurement result. The module, which is supplied with a nominal voltage of 12 V, can be mounted in a front chassis via a M19 thread with a locking nut or via snap hooks.

TDK offers compact high-current chokes for automotive and industrial applications
TDK Corporation presents the B82559A*A033 series of new shielded EPCOS ERU33 high-current chokes for through-hole mounting. Designed for very high saturation currents from 32 A to 83 A at 100 °C, the six new types cover a range of inductance values from 3.2 µH to 10 µH.

EMC Components: TDK develops industry’s first high-reliability chip beads for automotive
TDK Corporation announced the development and mass production of the MMZ1608-HE series of high-reliability chip beads for automotive use, compatible with high-durability solder in 150 ℃ environments.

Surge protection: Failsafe chip varistors for automotive battery lines
TDK Corporation presents a new range of Open Mode chip varistors for electronic automotive assemblies that are directly connected to the battery. The new chip varistors offer reliable protection against transient surge voltages according to ISO 7637-2, and meet the failsafe requirements according to the VW standard VW 80808. Even when subject to excessive bending stress, short-circuits are avoided, which is particularly important for unswitched battery terminals (e.g. terminal 30).

Inductors: Compact dual inductors with high saturation current
TDK Corporation has extended its range of dual inductors to include the new EPCOS series B82477D6*. The seven series types cover an inductance range from 2 x 3.9 µH to 2 x 47 µH and are designed for maximum rated currents from 2.83 A to 7.05 A. A special feature of the inductors, which are certified according to AEC-Q200 and compatible with RoHS, are the high saturation currents of up to 16.1 A.

Aluminum electrolytic capacitors: Compact design with high ripple current capability
TDK Corporation (TSE:6762) presents the new B43707* and B43727* series of EPCOS aluminum electrolytic capacitors with screw terminals. They are designed for rated voltages of between 400 V DC and 450 V DC and cover a capacitance range from 1800 µF to 18,000 µF.

TDK announces world’s first MIPI standard SoundWire® microphone
TDK Corporation (TSE: 6762) introduces the world’s first MIPI Standard SoundWire® microphone for mobile, IoT and other consumer devices. This multimode microphone pushes the boundaries of digital microphone acoustic performance while providing advanced feature sets with very low power.

Company of the week

Texas Instruments

Interesting video


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


Address Book


Texas Instruments


NeoCortec


PULSIV


MikroElektronika d.o.o.


Panasonic Industry


Cambridge GaN Devices


Traco Power


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


DANFOSS


MOXA


Alliance Memory


Intelliconnect (Europe) Ltd.



Calendary
electronica India 2025, Dehli, 17.-19.9.2025
productronica 2025, München, DE, 18.-21.11.2025
SEMICON Europa, München, DE, 18.-21.11.2025
sps 2025, Nuremberg, DE, 25.-27.11.2025
electronica 2026, München, DE, 10.-13.11.2026

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813