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Anritsu in Collaboration with Qualcomm Verifies 3GPP RAN5 Rel-17 Uplink Data Compression Testcases for 5G New Radio Standalone

ANRITSU CORPORATION is proud to announce verification and support of 3GPP RAN5 Rel-17 NR UDC testcases in collaboration with Qualcomm Technologies using the Qualcomm® X105 5G Modem-RF. This verification was conducted using Anritsu’s 5G NR Mobile Device Test Platform ME7834NR.

Global smartphone usage continues to grow rapidly, driving sustained increases in mobile data traffic alongside rising user expectations for consistent quality of service, regardless of network load or cell conditions. Users now expect always‑on connectivity with reliable performance across a wide range of usage scenarios. One effective approach to improving user experience and network efficiency is data compression.

Uplink transmissions often contain a significant proportion of protocol overhead, including IP and transport-layer headers, while traditional mechanisms such as Robust Header Compression (ROHC) address header compression.

3GPP Release 17 introduces Uplink Data Compression (UDC), enabling further reduction of redundant data prior to transmission. UDC operates at the UE side before radio transmission, improving uplink efficiency by reducing the volume of transmitted data where redundancy exists. This leads to improved spectral efficiency and increased effective user data throughput, particularly for traffic types that are not already compressed or encrypted.

Through this collaboration, Anritsu and Qualcomm Technologies, Inc. are supporting the industry’s validation of UDC conformance and interoperability, helping accelerate commercial implementation of 3GPP Release 17 features.

“Support for 3GPP Release 17 Uplink Data Compression test cases enables more efficient use of uplink radio resources by reducing redundant data prior to transmission,” said Yokoo Daizaburo, General Manager of Mobile Solutions Division at Anritsu. “By enabling accurate verification of UDC functionality, Anritsu supports operators and device vendors in improving effective uplink throughput and overall network efficiency, particularly in scenarios where data compression provides measurable benefits.”

“We are proud that our collaboration with Qualcomm Technologies supports the industry’s implementation and validation of new 5G features such as Release 17 Uplink Data Compression quickly and with confidence,” he added.  

The conformance tests are defined by 3GPP in TS 38.523-1 and aligned with the core requirements in TS 38.323. These tests have been submitted by Anritsu to 3GPP’s Radio Access Network Working Group 5 (RAN WG5). They are available on 3GPP RAN5 portal.

Solution Outline 5G NR Mobile Device Test Platform ME7834NR

The 5G NR Mobile Device Test Platform ME7834NR is registered as Test Platform 251 with both the GCF and PTCRB.

This platform supports 3GPP-based Protocol Conformance Test (PCT) and Carrier Acceptance Testing (CAT) of mobile devices incorporating Multiple Radio Access Technologies. It covers 5G NR in both Standalone and Non-Standalone modes, along with LTE, LTE-Advanced, LTE-A Pro, W-CDMA and NTN. When paired with Anritsu’s OTA RF chamber MA8171A and RF converters, the ME7834NR supports testing in sub-6 GHz and millimeter wave (mmWave) 5G NR frequency bands.

2026090101 / 01.09.2026 / Test & measurement / ANRITSU /

Anritsu in Collaboration with Qualcomm Verifies 3GPP RAN5 Rel-17 Uplink Data Compression Testcases for 5G New Radio Standalone

Anritsu Launches 5G RedCap Device Application Evaluation Solutions
Streamlined evaluation and wireless testing for growing 5G market

Anritsu Introduces Tensor™ VNA at IMS 2026, Redefining High Performance RF and Microwave Network Analysis

Anritsu Introduces PCI Express® 7.0 Receiver Test Solution Up to 128 GT/s
Supporting Development and Validation for Ultra-High-Speed Data Transmission in AI Data Center Servers

Anritsu and YOTASYS Collaborate on AI-Driven Spectrum Monitoring Solutions
Anritsu EMEA GmbH and YOTASYS AG today announced a collaboration to deliver advanced AI-enabled spectrum monitoring solutions. Under this collaboration, Anritsu provides the spectrum analyzer hardware technology, while YOTASYS acts as system integrator, combining Anritsu’s RF hardware with its own AI, software and GPU-based processing capabilities.

Anritsu Introduces ML2439A Power Meter with up to 4 Channels
Enhanced Versatility and Speed for Modern Power Measurement Applications

Anritsu Equips CERT Tunisia with Multi-Technology Wireless Test Infrastructure to Support National Device Certification
Anritsu EMEA GmbH has deployed a comprehensive wireless test solution at the Centre d'Étude et de Recherche de Télécommunications (CERT), Tunisia's national telecommunications testing authority.

Anritsu Expand General Purpose Instruments Portfolio via TTi Sales Agreement
ANRITSU CORPORATION has signed a sales agreement with Thurlby Thandar Instruments Limited (TTi), a UK based test and measurement instrument manufacturer.

Anritsu Delivers Comprehensive Automotive Ethernet Test Solution Using Tektronix Oscilloscope
Solution delivers precise Automotive Ethernet physical layer compliance for next-generation vehicles

Qualitas Semiconductor Selects Anritsu’s Vector Network Analyzer for High-Speed Interconnect Signal Integrity Verification
Verification Environment built using Anritsu ShockLine™ Vector Network Analyzer

Industry First, Anritsu Achieves EN 18052:2025 Certification for Hybrid eCall Evaluation
Certified end-to-end validation of eCall systems across 2G, 3G, and 4G networks

Anritsu Unveils Visionary 6G Solutions at MWC 2026
Intelligent transformation using AI, Cloud, and Virtual test technologies towards 6G


Company of the week

Vox Power

Interesting video


productronica 2025


electronica—Leading the way to the All Electric Society


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE

Address Book


Vox Power


Texas Instruments


STMicroelectronics


Future Electronics


TELEDYNE Vision Solution


Vexlum


Mitsubishi Electric


Parker Hannifin


QUECTEL


Infineon Technologies AG


Seica


NeoCortec


PULSIV


MikroElektronika d.o.o.


Panasonic Industry


Cambridge GaN Devices


Traco Power


BALLUFF


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics



Calendary
electronica 2026, München, DE, 10.-13.11.2026

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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